Rectangular Bond Force Concentrator for Reliable Substrate Bonding
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Solution Overview
Problem
Existing substrate bonding methods in semiconductor manufacturing are prone to failures, leading to unsuccessful encapsulation and wastage of the entire manufacturing process.
Innovation Solution
The use of a rectangular bond force concentrator to focus high pressure on a small area during bonding, followed by deformation and merging with adjacent layers to reduce pressure as the contact area increases, ensuring a strong and reliable bond.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate bonding methods are used, then the bonding process is simple, but the bonding reliability is low and encapsulation failures occur frequently
Solution Approach 1:
The bond force concentrator is fabricated on the substrate before the bonding process. This preliminary structure concentrates the bonding force at specific locations during encapsulation, ensuring reliable bond formation without requiring complex bonding process adjustments. The concentrator is created through standard semiconductor fabrication steps (depositing sacrificial material, forming openings, and filling with bonding material) performed before wafer bonding.
Solution Approach 2:
The bonding force is segmented and concentrated at discrete locations rather than distributed uniformly across the entire substrate. Multiple bond force concentrators can be placed at different locations to create multiple reliable bonding points, improving overall bonding reliability while keeping each individual concentrator structure simple and manageable.
2Strength
If high pressure is applied during bonding to ensure strong bonds, then bonding strength increases, but residual stress and risk of substrate breakage increase
Solution Approach 1:
The bonding pressure is locally concentrated at the bond force concentrator locations rather than applied uniformly across the entire substrate. The concentrator structures (with their specific geometry such as narrower width than the overlying bonding material) create localized high pressure zones that ensure strong bonding at critical interfaces while the rest of the substrate experiences minimal stress, preventing breakage and reducing residual stress.
3Productivity
If uniform pressure is applied across the bonding area, then the process is easy to control, but bonding efficiency is low and encapsulation failures occur
Solution Approach 1:
The bond force concentrator structure is prepared in advance during standard fabrication processes. This preliminary preparation eliminates the need for complex real-time pressure control during bonding, as the concentrator geometry automatically directs and concentrates the force where needed. The process remains easy to control while achieving high bonding efficiency through the pre-engineered force distribution.
4Reliability
If bonding failures occur, then the entire manufacturing process is wasted, but implementing complex bonding solutions increases manufacturing cost
Solution Approach 1:
The bond force concentrator is fabricated using standard semiconductor manufacturing steps (depositing sacrificial material like silicon dioxide or silicon nitride, forming openings, and filling with bonding material such as metal or dielectric) before the bonding process. This approach integrates the reliability-enhancing feature into the existing fabrication flow without requiring additional complex equipment or processes, thus improving encapsulation success rate while avoiding significant increases in manufacturing cost.
Data Source
AI summary
Herein is provided a method for bonding a first substrate with a second substrate, comprising the steps of: providing a first and a second substrate, and bonding the first substrate and the second substrate together using a rectangular bond force concentrator to form a bond, wherein the first substrate or the second substrate comprises a device. Herein is further provided an apparatus comprising a first substrate and a second substrate bonded together using a rectangular bond force concentrator to form a bond. Herein is further provided a use of a bond force concentrator in bonding a first substrate and a second substrate to form a bond.