Bond-free Microcircuit Housing for Detachable PCB Assembly
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Solution Overview
Problem
The existing methods for testing microcircuits require a full printed circuit assembly, which can be time-consuming and costly, and troubleshooting is complicated due to the permanent or semi-permanent tie between the microcircuit housing and the printed circuit assembly, leading to potential damage and high expenses, especially for high-frequency circuitry.
Innovation Solution
A fully detachable microcircuit housing that can be attached to a printed circuit assembly using mechanical fasteners, allowing for assembly and testing before the printed circuit assembly arrives, and enabling easy removal for repair or replacement, using a thin film circuit interface and conductive elastomer pins for electrical connections without bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the microcircuit housing is permanently or semi-permanently bonded to the printed circuit assembly, then the connection is stable and reliable, but troubleshooting becomes complicated and damage to either component results in loss of both components
Solution Approach 1:
The patent divides the assembly into separable components: the microcircuit housing and the printed circuit assembly remain physically distinct and can be detached from each other. This segmentation allows independent handling, testing, and repair of each component while maintaining a stable electrical connection through the conductive elastomer pins that bridge the interface between the two separated parts.
2Strength
If the microcircuit housing is bonded to the printed circuit assembly, then the assembly is structurally sound, but the cost of damage to either component is high and time-consuming to replace
Solution Approach 1:
The patent divides the assembly into separable components: the microcircuit housing and the printed circuit assembly remain physically distinct and can be detached from each other. This segmentation allows independent handling, testing, and repair of each component while maintaining a stable electrical connection through the conductive elastomer pins that bridge the interface between the two separated parts.
Solution Approach 2:
The patent enables recovery and reuse of expensive components. When damage occurs to either the microcircuit housing or the printed circuit assembly, the undamaged component can be recovered and reused by simply replacing the damaged counterpart, rather than discarding the entire bonded assembly. This significantly reduces replacement costs and time.
3Productivity
If the microcircuit housing is attached before the printed circuit assembly arrives, then manufacturing productivity is improved, but the risk of damage to the printed circuit assembly increases
Solution Approach 1:
The patent implements protective measures in advance by using a compliant thermal layer and a compliant interface layer between the microcircuit housing and the printed circuit assembly. These cushioning layers absorb mechanical stresses and prevent direct transmission of damaging forces during handling and assembly operations, enabling early attachment without increasing damage risk.
4Reliability
If bond wires are used to connect the microcircuit content to the printed circuit assembly, then electrical connection is achieved, but the process is time-consuming and adds complexity
Solution Approach 1:
The patent replaces the traditional mechanical bond wire connection process with a direct electrical contact system using conductive elastomer pins. Instead of manually or automatically welding thin wires to connect the microcircuit housing to the printed circuit assembly, the conductive elastomer pins provide inherent electrical connectivity through their compliant contact mechanism, eliminating the time-consuming wire bonding step while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for earlier fault detection, reduced costs by preventing damage to both the microcircuit housing and printed circuit assembly, and improved manufacturing yield by enabling testing and verification before comprehensive testing, while providing flexibility in assembly and troubleshooting.
Implementation Method 1
a compressible conductive elastomer pin attached to a lower surface of the thin film circuit interface that makes electrical contact to a printed circuit assembly
Data Source
AI summary
A method of assembling a fully detachable microcircuit starts with obtaining a fabricated microcircuit housing with an upper surface, a lower surface, a first recess in the upper surface, a second recess in the lower surface, and a pin on the lower surface. A thermal layer is applied to the lower surface. A conductive elastomer signal pin connector and a ground pin connector are attached to a thin film circuit, and the thin film circuit with is inserted into the second recess with the conductive elastomer signal pin connector and the ground pin connector attached. A bonding target is applied to the upper surface. The bonding target and the microcircuit are connected with a bond wire. The microcircuit housing is screwed to a printed circuit assembly without bonding the microcircuit housing to the printed circuit assembly.