Bond Head Collet Look-Through Passage Alignment
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Solution Overview
Problem
Existing bonding apparatuses face challenges in accurately aligning electrical components with bonding areas due to difficulties in capturing clear images of fiducial marks when the bond head collet is holding the component, and current methods are limited to specific component sizes or fiducial mark patterns.
Innovation Solution
A bonding apparatus with a look-through passage through the bond head collet allows an optical unit to directly view the electrical component, enabling improved alignment by capturing images of fiducial marks on both the component and the base member at the same vertical position, minimizing movement and enhancing alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If images of fiducial marks are captured prior to pick-up by the bond head collet, then alignment information can be obtained, but it is difficult to capture clear images when the component is being held by the bond head collet
Solution Approach 1:
The bond head collet is divided into multiple transparent segments or sections along its length. This segmentation allows optical access to the fiducial marks on the electrical component at multiple positions, enabling clear imaging while the component is held by the collet without requiring removal or special positioning.
Solution Approach 2:
A transparent window or optical passage is introduced as an intermediary element between the optical sensor and the fiducial marks on the electrical component. This window allows light to pass through the bond head collet structure itself, enabling direct viewing and imaging of the component's fiducial marks while being held in the collet.
2Adaptability or versatility
If existing alignment methods are used, then alignment can be achieved for specific component sizes, but the methods are limited to electrical components of a specific size or fiducial marks arranged in a specific pattern
Solution Approach 1:
The bond head collet is designed with a universal transparent structure that can accommodate electrical components of various sizes and fiducial mark patterns. The transparent design allows the same collet and imaging system to work with different component types, eliminating the need for specialized collets or imaging configurations for each component size or pattern.
Solution Approach 2:
The imaging system transitions from capturing images only before pick-up to capturing images through the bond head collet during holding. This dimensional change in the imaging process enables continuous alignment verification and adjustment, improving adaptability to various component sizes and patterns while maintaining high alignment precision.
3Strength
If the bond head collet is opaque, then it can provide structural support and bonding force, but it blocks optical access to the electrical component for alignment inspection
Solution Approach 1:
The bond head collet is designed with non-uniform optical properties: the main body remains opaque for structural support and force transmission, while specific localized regions (windows or passages) are made transparent to allow optical access. This local quality differentiation enables simultaneous achievement of mechanical strength and optical inspectability.
Solution Approach 2:
The bond head collet is constructed using composite materials or material combinations with different optical and mechanical properties. The composite structure provides both the mechanical strength needed for bonding force transmission and the optical transparency required for imaging fiducial marks, resolving the contradiction between strength and optical access.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the accuracy and quality of the bonding process by allowing direct inspection and alignment of the electrical component with the bonding area, accommodating various component sizes and fiducial mark patterns, and facilitating heat transfer and force transmission during bonding.
Implementation Method 1
an optical unit positioned relative to the bond head structure to view and inspect the electrical component through the look-through passage of the bond head structure
Implementation Method 2
an actuator unit configured to move the connecting unit of the bond head structure based on the inspection of the electrical component by the optical unit, to align the electrical component with the bonding area of the base member
Implementation Method 3
During this period of time, heat may be applied to the securing material to change a state of the securing material, so that the securing material is capable of holding the electrical component and the base member together
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A bonding apparatus includes a bond head structure, an optical unit and an actuator unit. The bond head structure includes a bond head collet, a connecting unit to which the bond head collet is attached and a look-through passage extending through the bond head collet and the connecting unit along a central axis of the bond head structure. In use, the bond head collet holds an electrical component to be bonded to a bonding area of a base member and the optical unit is positioned relative to the bond head structure to view and inspect the electrical component through the look-through passage of the bond head structure. The actuator unit moves the connecting unit of the bond head structure based on the inspection of the electrical component by the optical unit, to align the electrical component with the bonding area of the base member.