Bond Head Collet Vacuum Distribution for Thermal Compression Die Bonding

Solution Overview

Problem

Existing bond head designs for semiconductor die bonding require multiple vacuum grooves to accommodate different collet sizes, leading to a complex vacuum system and limited ability to handle rapid thermal changes due to high thermal mass, which complicates the process and restricts the number of supported collet sizes.

Innovation Solution

A bond head design featuring a collet with vacuum distribution channels on its surface, allowing for secure attachment and heat transfer without the need for multiple vacuum grooves on the bond head heater, using only two vacuum suction holes and customizable vacuum grooves for different collet sizes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple vacuum grooves are incorporated into the bond head heater to accommodate different collet sizes, then the ability to hold various collet sizes is improved, but the device complexity and thermal mass increase

Engineering Contradiction:

Improveability to hold various collet sizesVSAvoidvacuum system complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The vacuum distribution function is segmented from the bond head heater to the collet itself. The collet now contains internal vacuum distribution channels that receive vacuum through a single hole in the bond head heater, dividing the complex multi-groove system into simpler components where the collet handles distribution internally.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of having the bond head heater provide vacuum distribution through multiple grooves to accommodate different collet sizes, the invention inverts the approach by having the collet contain the vacuum distribution channels and receive vacuum through a single hole in the heater. This reverses which component contains the complexity.

Inventive Principle:

Principle #13The other way round (Inversion)

2Adaptability or versatility

If multiple vacuum grooves are incorporated into the bond head heater to accommodate different collet sizes, then the ability to hold various collet sizes is improved, but the thermal mass increases reducing rapid temperature change capability

Engineering Contradiction:

Improveability to hold various collet sizesVSAvoidrapid temperature change capability

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The vacuum distribution function is segmented from the bond head heater to the collet itself. The collet now contains internal vacuum distribution channels that receive vacuum through a single hole in the bond head heater, dividing the complex multi-groove system into simpler components where the collet handles distribution internally.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of having the bond head heater provide vacuum distribution through multiple grooves to accommodate different collet sizes, the invention inverts the approach by having the collet contain the vacuum distribution channels and receive vacuum through a single hole in the heater. This reverses which component contains the complexity.

Inventive Principle:

Principle #13The other way round (Inversion)

3Temperature

If the collet interface surface area is reduced to lower thermal mass, then rapid heating capability is improved, but the vacuum holding capability for different collet sizes becomes limited

Engineering Contradiction:

Improverapid heating capabilityVSAvoidsupport for different collet sizes

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The collet interface area is made dynamic and adjustable through internal vacuum distribution channels that can adapt to different collet sizes. The collet maintains a consistent external interface area with the bond head heater for thermal efficiency, while internally distributing vacuum across variable areas to accommodate different die and collet sizes.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The vacuum distribution parameters within the collet are changed to accommodate different collet sizes. By modifying the internal channel configuration and vacuum distribution pattern rather than the external interface area, the system maintains optimal thermal contact area while adapting to various collet dimensions.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the vacuum system, reduces thermal mass, and allows for secure attachment and efficient heat transfer across various collet sizes, enhancing the bond head's performance and ease of manufacturing while accommodating different die sizes without altering the bond head heater.

Implementation Method 1

a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a die vacuum suction hole on the bond head heater that is operative to apply a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater that is operative to apply a vacuum suction force to hold the die

Methodology Applied

Scientific EffectVacuum suction: Vacuum

Data Source

PatentUS9281290B2Bond head for thermal compression die bonding

Publication Date: 2016.03.08 ASMPT SINGAPORE PTE LTD

AI summary

A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.