Bond Head Heater Cooling via Detachable Flow Plate
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Solution Overview
Problem
Existing cooling systems for bond heads in semiconductor devices face limitations in cooling rate due to material properties and fabrication constraints, which restrict heating capacity and flow pattern optimization.
Innovation Solution
A detachable flow generation plate is introduced between the insulation block and the heater plate, featuring narrow slots and fins to direct cooling gas efficiently onto the heater plate, allowing for faster cooling and reducing reliance on material properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulation block is made from material with low thermal conductivity and low coefficient of thermal expansion, then the material properties are optimized for insulation, but the heating capacity and fabrication freedom are compromised
Solution Approach 1:
The bond head is divided into separate functional components: the insulation block and the flow generation plate. The flow generation plate is detachably mounted to the insulation block, allowing the cooling function to be separated from the insulation function. This segmentation enables independent optimization of each component's material properties and fabrication methods without compromising the other.
Solution Approach 2:
The flow generation plate acts as an intermediary component between the insulation block and the heater plate. It introduces a dedicated flow channel structure that directs cooling gas onto the heater plate, mediating the cooling function without requiring the insulation block itself to have complex flow channels, thus preserving fabrication freedom while achieving optimized cooling.
2Productivity
If the flow channels include small holes in the insulation block, then cooling is achieved, but the flow speed and flow pattern are limited during mechanical fabrication
Solution Approach 1:
The flow channel function is segmented from the insulation block and placed in a separate flow generation plate. This plate features specifically designed narrow slots and fins that can be precisely fabricated to control gas flow patterns. The segmentation allows the flow channels to be optimized for high flow speed and precise flow pattern control without being constrained by the insulation block's material properties or fabrication limitations.
Solution Approach 2:
The flow generation plate introduces parameter changes in the form of narrow slots with specific dimensions and fin structures. These geometric parameters are optimized to control the cooling gas flow speed and distribution pattern, enabling precise flow pattern optimization that would be difficult to achieve with simple holes in the insulation block alone.
3Reliability
If the designer places priority on material properties of the insulation block, then material performance is optimized, but heating capacity is compromised
Solution Approach 1:
The heating and cooling functions are segmented into separate components. The heater plate maintains direct contact with the insulation block for efficient heating, while the detachable flow generation plate provides the cooling function. This segmentation allows the insulation block to be optimized for thermal insulation properties without compromising heating capacity, as the cooling path is provided by the separate flow generation plate with its dedicated flow channels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling rates by up to 20% compared to prior art, offering greater freedom in material selection and machining precision, leading to improved cooling performance.
Implementation Method 1
a flow generation plate which is configured to direct cooling gas from the insulation block onto the heater plate so as to rapidly cool the heater plate
Implementation Method 2
the heater plate being operative to heat the semiconductor device that is held by the collet
Data Source
AI summary
A bond head comprises an insulation block, a heater plate attached to the insulation block and a collet located on the heater plate for holding a semiconductor device. The heater plate is operative to heat the semiconductor device that is held by the collet. A flow generation plate that is detachably mounted between the insulation block and the heater plate is configured to direct cooling gas from the insulation block onto the heater plate so as to rapidly cool the heater plate.