Bond Head Cooling Apparatus Using Dielectric Liquid Spray
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Solution Overview
Problem
Conventional cooling methods for bond heads in electronic device bonding machines have limited cooling rates and high gas consumption, which hinder efficient heat dissipation and productivity.
Innovation Solution
A cooling apparatus that uses a dielectric liquid and gas mixture sprayed onto the heater surface via a spray nozzle, controlled by solenoid valves and a recirculation system, to enhance cooling efficiency and reduce gas usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional air or gas cooling is used for the bond head, then the cooling system is simple, but the cooling rate is limited and gas consumption is high
Solution Approach 1:
The patent applies hydraulic cooling by injecting dielectric liquid into the bond head cooling chamber, utilizing fluid dynamics to achieve rapid heat removal. The liquid cooling system replaces conventional gas cooling, leveraging the higher specific heat capacity and thermal conductivity of liquids to dramatically improve cooling rate while reducing consumable usage.
Solution Approach 2:
The patent changes the cooling medium parameter from gas to dielectric liquid, fundamentally altering the thermal transfer characteristics. This parameter change enables the cooling rate to increase from conventional limited rates to up to 100°C per second, while the dielectric liquid can be recirculated and reused, reducing consumption.
2Productivity
If pulse heating is applied to heat the semiconductor die rapidly, then bonding time is reduced, but the temperature needs to be reduced quickly afterward requiring efficient cooling
Solution Approach 1:
The patent incorporates temperature sensing and control mechanisms that monitor the bond head temperature in real-time and adjust the dielectric liquid flow rate accordingly. This feedback control enables precise temperature management, allowing rapid heating during bonding followed by controlled cooling, thereby maintaining high productivity while achieving accurate temperature profiles.
Solution Approach 2:
The cooling system operates in periodic cycles synchronized with the bonding process - during pulse heating, cooling is minimized to maintain temperature, and after bonding completion, cooling is activated to rapidly reduce temperature. This periodic action pattern enables fast bonding cycles with precise temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a significantly faster cooling rate of up to 100° C per second, reduces water flow rate and pressure, and allows for adjustable cooling rates, resulting in improved productivity and longer heater lifespan.
Implementation Method 1
a spray nozzle located next to a surface of the heater, the spray nozzle being operatively connected to both the dielectric liquid supply and the gas supply; wherein the spray nozzle is operative to spray a liquid-gas mixture comprising the dielectric liquid and the gas towards the surface of the heater for cooling the heater
Data Source
AI summary
A cooling apparatus is provided for a bond head which has a collet to hold a semiconductor die and a heater to heat the semiconductor die held by the collet. The cooling apparatus includes a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle sprays a liquid-gas mixture of the dielectric liquid and the gas towards the surface of the heater.