Bond Head Heater Fluid Chamber Cooling for Faster Thermal Cycling

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Solution Overview

Problem

Existing bond head heater cooling systems are limited by low cooling rates and operational temperature limitations, particularly when using compressed gas or elastomer-based sealing systems, which hinder productivity and compatibility with high-temperature bonding processes.

Innovation Solution

A cooling system for bond head heaters featuring fluid chambers with a heat transmission path next to the heater plate, utilizing a mixture of compressed gas and liquid to generate cooling spray, which is recycled and controlled for efficient heat removal, allowing higher operating temperatures and faster cooling rates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If compressed gas is used to cool the bond head heater, then cooling is achieved, but the cooling rate is limited and compressed gas consumption is large

Engineering Contradiction:
Improvecooling rateVSAvoidcompressed gas consumption
Core Design Contradiction:
SpeedVSLoss of substance

Solution Approach 1:

The patent employs a dual cooling medium system that combines compressed gas and liquid (typically water or water-based coolant) to cool the bond head heater. The liquid coolant flows through channels in the bond head heater, providing efficient heat removal, while compressed gas can be used to enhance cooling or replace the liquid in certain phases. This hybrid approach achieves higher cooling rates while reducing overall compressed gas consumption compared to gas-only cooling systems.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Speed

If water sprays are generated directly onto the heater plate for cooling, then cooling efficiency is improved, but elastomer O-rings limit the operational temperature to below 300°C

Engineering Contradiction:
Improvecooling rateVSAvoidoperational temperature
Core Design Contradiction:
SpeedVSTemperature

Solution Approach 1:

The patent introduces a thermal barrier or intermediary layer between the water spray cooling system and the heater plate. This intermediary structure allows the water spray to cool the heater plate effectively while preventing direct contact between the water and high-temperature components, thereby enabling operational temperatures above 300°C. The intermediary may include specialized coatings, thermal barriers, or a dual-chamber design that separates the cooling fluid path from the heating elements.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If the bond head heater is cooled quickly to improve productivity, then cooling rate increases, but deformation risks increase

Engineering Contradiction:
Improvebonding cycle speedVSAvoiddeformation risk
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent implements non-uniform or localized cooling strategies where different regions of the bond head heater receive different cooling intensities. Critical areas prone to deformation are cooled more gradually or with reduced intensity, while other regions undergo aggressive cooling to maintain overall productivity. This may involve varying cooling channel configurations, adjusting coolant flow rates to specific zones, or using multiple cooling stages with different cooling rates to balance productivity and deformation prevention.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves significantly improved cooling rates, up to 54°C per second, and operates at higher temperatures without elastomer limitations, enhancing productivity and reducing deformation risks.

Implementation Method 1

the at least one fluid chamber being thermally coupled to the heater plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat transmission path lying substantially next to the heater plate through which the fluid is configured to flow when the fluid is travelling between the fluid inlet and the fluid outlet

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20250326073A1Bond head heater incorporating fluid chamber for cooling
Publication Date: 2025.10.23 ASMPT SINGAPORE PTE LTD
  • US20250326073A1 patent drawing
  • US20250326073A1 patent drawing
  • US20250326073A1 patent drawing

AI summary

A cooling system provided for a bond head heater including a heater plate which is operative to heat a die that is being held adjacent to the bond head heater has at least one fluid chamber thermally coupled to the heater plate. The fluid chamber includes an enclosure for containing a fluid, and a fluid inlet and a fluid outlet coupled to the fluid chamber. Fluid is introduced into the fluid chamber through the fluid inlet and is exhausted from the fluid chamber through the fluid outlet. The fluid is configured to flow through a heat transmission path lying substantially next to the heater plate when the fluid is travelling between the fluid inlet and the fluid outlet.