Bond Head Heater Clamping System for Thermal Expansion Control
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Solution Overview
Problem
In semiconductor packaging, thermocompression bonding processes face challenges with unpredictable heater expansion and contraction, affecting placement accuracy due to the need for rapid heating and cooling, which complicates maintaining the relative position of the heater during bonding.
Innovation Solution
A bond head assembly with a clamping system using elastic elements, such as titanium, constrains the heater along multiple axes to maintain its position during heating and cooling, ensuring balanced elastic forces and precise control of the bonding tool's position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the heater is rapidly heated and cooled to improve machine throughput, then productivity is improved, but manufacturing precision deteriorates due to unpredictable heater expansion and contraction
Solution Approach 1:
The patent applies parameter changes by selecting materials with specific thermal expansion coefficients. The elastic elements are made from materials whose thermal expansion characteristics compensate for the heater's expansion and contraction, maintaining placement accuracy despite rapid temperature changes required for high productivity
Solution Approach 2:
The patent employs composite material selection where the elastic elements are made from materials combining specific mechanical and thermal properties. These composite material characteristics enable the elastic elements to maintain structural integrity while compensating for thermal expansion, resolving the contradiction between rapid heating/cooling and placement precision
2Manufacturing precision
If the heater temperature is varied at different locations and times to improve bonding process quality, then manufacturing precision is improved, but device complexity increases due to the need for precise temperature control
Solution Approach 1:
The patent applies local quality by creating asymmetric elastic element configurations where different elements have different stiffness properties. This allows different regions of the heater to be constrained with appropriate local characteristics, enabling precise temperature and position control without requiring a complex active control system for each location
Solution Approach 2:
The elastic elements are designed to automatically compensate for thermal expansion and maintain heater positioning through their inherent elastic properties. This passive self-compensating mechanism reduces the need for complex active control systems, lowering device complexity while maintaining manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution stabilizes the heater's position, maintaining precise control during heating and cooling phases, thereby enhancing the accuracy and efficiency of thermocompression bonding processes.
Implementation Method 1
a clamping system for securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes
Implementation Method 2
heat is applied to the semiconductor element being bonded (e.g., through a heater in a bond head assembly carrying the bond tool)
Implementation Method 3
Unpredictable expansion and contraction of the heater, resulting from heating and cooling of the heater
Data Source
AI summary
A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes.