Bond Head Positioning With Optical Correction for Chip Mounting
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Solution Overview
Problem
Current mounting apparatuses for semiconductor and flip chips on substrates achieve only a positioning accuracy of 2 to 3 micrometers with a standard deviation of 3 sigma, which is not sufficient for precise component placement.
Innovation Solution
The apparatus includes a bond head with a component gripper, multiple drive systems for precise movement, and cameras for position determination using reference marks on both the component and substrate, enabling high-precision correction movements and submicrometer-range accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If standard mounting apparatuses are used, then the device complexity is low, but the positioning accuracy is insufficient (2 to 3 micrometers)
Solution Approach 1:
The mounting apparatus is divided into multiple independent drive systems: a first drive system for coarse positioning and a second drive system for fine positioning. This segmentation allows each subsystem to be optimized for its specific function, achieving high overall positioning accuracy without requiring a single overly complex system
Solution Approach 2:
Reference marks are introduced as intermediary elements that serve as common reference points for both the component camera and substrate camera. These marks enable precise position determination by providing a stable reference framework that links the coordinate systems of different measurement devices
Solution Approach 3:
Optical measurement systems (cameras) replace purely mechanical positioning systems. The cameras detect reference marks and component marks to determine positions optically, eliminating the need for complex mechanical encoders and achieving submicrometer positioning accuracy through optical feedback
2Manufacturing precision
If multiple drive systems and cameras are added to improve positioning accuracy, then the positioning accuracy improves to submicrometer range, but the device complexity increases
Solution Approach 1:
The positioning task is segmented into coarse positioning (first drive system) and fine positioning (second drive system). The first drive system handles large movements with lower precision requirements, while the second drive system handles small corrections with high precision requirements. This segmentation allows each subsystem to be simpler while achieving high overall accuracy
Solution Approach 2:
The system uses self-service through automated optical detection and feedback. The cameras automatically detect reference marks and component marks, calculate position deviations, and the drive systems automatically execute correction movements. This closed-loop self-correction reduces the need for complex manual intervention and calibration mechanisms
Data Source
AI summary
The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. At least one reference mark is attached to the bond head or the component gripper.