Bond Head Nozzle Shape Adjustment for Void-Free Hybrid Bonding
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Solution Overview
Problem
Hybrid bonding interconnects require high placement accuracy due to tight interconnect pitches, leading to runout errors and voids, especially in die-to-wafer bonding, where varying die shapes and stresses cause overlay errors and scaling issues, resulting in costly bond head collateral changes and reduced throughput.
Innovation Solution
An in-line die shape monitoring and feedback system adjusts the die shape using a unique bond head nozzle design with actuators and vacuum devices to correct warpage and runout, ensuring void-free bonding and reduced scaling errors across different die variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If hybrid bonding interconnect pitch is reduced to increase bandwidth density, then interconnect density improves, but placement accuracy requirements increase leading to runout errors and voids
Solution Approach 1:
The system performs preliminary measurement of die shape and runout characteristics before bonding, then pre-adjusts the die shape using actuators to compensate for expected warpage and runout errors, ensuring accurate placement at tight pitches
Solution Approach 2:
The system continuously monitors die shape and placement position in real-time during bonding, using feedback signals to dynamically adjust actuator positions and correct runout errors, ensuring placement accuracy despite varying die characteristics
2Reliability
If die shape variations are present, then bonding voids occur, but adjusting die shape requires complex actuators and vacuum devices
Solution Approach 1:
The bond head is divided into multiple independent actuator zones and vacuum device regions, allowing localized adjustment of die shape in different areas, enabling complex shape corrections through coordinated simple modular components
Solution Approach 2:
The actuator system serves multiple functions: it adjusts die shape, compensates for runout errors, and maintains die positioning, replacing what would otherwise require separate dedicated devices for each function
3Manufacturing precision
If frequent bond head collateral changes are made to accommodate different die variations, then bonding accuracy improves, but throughput decreases
Solution Approach 1:
The bond head features dynamically adjustable actuators and vacuum devices that can be reconfigured in real-time to match different die shapes and sizes, eliminating the need for physical collateral changes while maintaining optimal bonding accuracy for each die type
Solution Approach 2:
The system adjusts actuator positions, vacuum pressure, and bonding force parameters dynamically based on detected die characteristics, allowing a single bond head to accommodate varying die specifications without physical modifications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances bonding reliability by mitigating die shape variations and stresses, reducing defects and the need for frequent bond head collateral changes, thereby improving throughput and cost-effectiveness.
Implementation Method 1
a vacuum device of a placer that carries the die to adjust the shape profile
Implementation Method 2
an actuator of a placer that carries the die to displace portions of the die, thereby adjusting a shape profile
Implementation Method 3
the dielectric surfaces on the two bonding interfaces bond together due to Van der Waals forces
Implementation Method 4
as a result of a post-bond anneal, the dielectrics form strong covalent bonds, and the metals form electrical joints
Data Source
AI summary
Methods and apparatus for die shape modification bonding are disclosed. A disclosed apparatus to adjust a die for bonding to a target includes interface circuitry, machine-readable instructions, and at least one processor circuit to be programmed by the machine-readable instructions to determine a shape profile of the die, determine an adjustment of the shape profile with respect to the bonding of the die to the target, and cause at least one of (i) an actuator or (ii) a vacuum device of a placer that carries the die to adjust the shape profile based on the determined adjustment.