Bond-Interface Security Circuitry for Anti-Probing Chip Structures
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Solution Overview
Problem
Current security architectures for semiconductor chips are vulnerable to hacking techniques such as probing, delayering, electromagnetic waves, and fault injection, which can compromise the confidentiality and security of sensitive components like encryption keys and proprietary information.
Innovation Solution
A bonded structure is created using two semiconductor elements directly bonded without adhesives, with security circuitry extending across the bond interface, including dielectric-to-dielectric and conductor-to-conductor direct bonds, and additional protective elements with obstructive materials to prevent external access and fault injection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional single-chip security architecture is used, then the device structure is simple and easy to manufacture, but the security against hacking techniques (probing, delayering, electromagnetic waves, fault injection) is insufficient
Solution Approach 1:
The security circuitry is divided into multiple segments distributed across two or more bonded semiconductor elements. The first security circuit block is formed in a first semiconductor element and a second security circuit block is formed in a second semiconductor element, with the security circuitry extending across the bond interface. This segmentation prevents attackers from accessing the complete security function through single-chip techniques such as probing or delayering.
Solution Approach 2:
The patent transitions from a two-dimensional single-chip security architecture to a three-dimensional bonded structure where security circuitry spans across multiple stacked semiconductor elements. By extending the security circuitry across the bond interface between stacked elements, the system adds a vertical dimension that complicates physical attack vectors while maintaining security functionality.
2Reliability
If security circuitry is distributed across multiple bonded semiconductor elements, then security against fault injection and external access is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The bonding interfaces are prepared in advance during the semiconductor manufacturing process, with bonding surfaces formed on separate elements before final assembly. This preliminary preparation of bonding surfaces allows for controlled, high-precision bonding that reduces manufacturing complexity despite the multi-element architecture.
Solution Approach 2:
The bonding interface acts as an intermediary connection between separate security circuit blocks, allowing the security functionality to span elements while maintaining manufacturing modularity. The bond interface enables electrical and physical connection without requiring complex integrated fabrication of the entire security system in a single chip.
3Ease of manufacture
If adhesive materials are used for bonding semiconductor elements, then the bonding process is easier, but the security against electromagnetic waves and fault injection is reduced
Solution Approach 1:
The adhesive material is completely removed from the bonding process. The patent specifies direct bonding of semiconductor elements without adhesives, extracting the harmful element (adhesive that could transmit electromagnetic waves and facilitate fault injection) from the system while maintaining the bonding functionality through direct material-to-material contact.
Data Source
AI summary
A bonded structure is disclosed. The bonded structure can include a first semiconductor element having a first front side and a first back side opposite the first front side. The bonded structure can include a second semiconductor element having a second front side and a second back side opposite the second front side, the first front side of the first semiconductor element directly bonded to the second front side of the second semiconductor element along a bond interface without an adhesive. The bonded structure can include security circuitry extending across the bond interface, the security circuitry electrically connected to the first and second semiconductor elements.