Non-Destructive Bond Line Parameter Measurement Using 3D Data
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for determining the bond line parameter of a circuit assembly require destructive measurement, which is inefficient and can damage the assembly.
Innovation Solution
A method and system for generating a bond line parameter of a circuit assembly using three-dimensional data from sensors such as optical sensors, laser scanners, or computerized tomography scanners, allowing for non-destructive measurement by aligning and combining data from different components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If destructive measurement methods are used to determine bond line parameters, then measurement precision can be achieved, but the circuit assembly is damaged and productivity decreases
Solution Approach 1:
The patent creates a digital 3D copy (virtual model) of the circuit assembly using optical scanning technology. This virtual model allows measurement of bond line parameters without physically touching or damaging the actual assembly. The point cloud data and mesh models serve as digital replicas that can be analyzed repeatedly without degradation, resolving the contradiction between obtaining precise measurements and maintaining productivity.
Solution Approach 2:
The patent replaces destructive mechanical measurement methods with non-contact optical measurement systems. Instead of using physical probes or cutting tools that damage the assembly, the system uses light-based scanning to capture 3D geometry and derive bond line parameters. This substitution eliminates the harmful mechanical interaction while maintaining measurement capability, thereby improving both precision and productivity.
2Productivity
If non-destructive measurement methods are used, then productivity is improved, but measurement precision may be insufficient
Solution Approach 1:
The patent transitions from 2D surface scanning to comprehensive 3D volumetric measurement by capturing point cloud data from multiple angles and depths. This multi-dimensional approach allows accurate determination of bond line thickness and geometry without contact. The 3D spatial information provides sufficient precision for bond line parameter measurement while maintaining the non-destructive nature of the measurement process.
Solution Approach 2:
The patent performs preliminary 3D scanning and virtual model creation before any physical measurement or assembly disassembly is attempted. By establishing the digital twin in advance, all subsequent measurements can be performed on the virtual model, ensuring both high precision and zero damage to the actual assembly. This preliminary digital characterization enables accurate bond line parameter extraction without compromising productivity.
3Loss of information
If multiple data sets from different components are aligned and combined, then measurement completeness is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple point cloud data sets from different components (e.g., IHS, heat sink, TIM) into a single integrated 3D model. By combining these individual scans with proper alignment and registration, the system achieves complete coverage of the bond line region. This merging process consolidates fragmented information into a comprehensive virtual model, improving measurement completeness while managing system complexity through automated integration algorithms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, non-destructive measurement of the bond line parameter, allowing for real-time assessment and adjustment of manufacturing processes to ensure proper assembly and thermal performance.
Implementation Method 1
capturing, by an optical sensor, three-dimensional data of the circuit assembly
Implementation Method 2
laser scanner
Implementation Method 3
capturing, by a sensor, three-dimensional data of the circuit assembly
Implementation Method 4
computerized tomography scanner
Implementation Method 5
computerized tomography scanner
Data Source
AI summary
Methods and systems for generating a bond line parameter of a circuit assembly, and methods of manufacture of a circuit assembly are provided. The method comprises capturing, by a sensor, third three-dimensional data of the circuit assembly. The third three-dimensional data corresponds to a first region of a first component and a first region of a second component. Data corresponding to a second region of the first component and at least a portion of the first region of the second component are not present in the third three-dimensional data. The bond line parameter of the circuit assembly can be determined based on first three-dimensional data of the first component, second three-dimensional data of the second component, and the third three-dimensional data.