Interconnected Bond Pads Reduce Inductance in IC Power Delivery
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Solution Overview
Problem
Integrated circuit device performance is limited by signal integrity issues, particularly due to switching noise caused by simultaneous switching of output driver circuits, which restricts operating clock frequency and reduces performance.
Innovation Solution
Reducing inductance in supply voltage or ground nets by electrically interconnecting supply voltage or ground bond pads, bond fingers, and solder balls to create parallel connections, thereby decreasing overall inductance and switching noise, and allowing for increased operating clock frequency without increasing manufacturing resources or costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inductance in supply voltage or ground nets is reduced by electrically interconnecting bond pads, bond fingers, and solder balls, then signal integrity is improved and operating clock frequency can be increased, but device complexity increases
Solution Approach 1:
The patent merges multiple supply voltage bond pads, bond fingers, and solder balls into electrically interconnected networks. By combining these previously separate elements into unified conductive structures, the overall inductance is reduced while maintaining signal integrity and enabling higher operating frequencies without proportionally increasing device complexity
Solution Approach 2:
The patent segments the supply voltage and ground connections into multiple parallel paths through bond pads, bond fingers, and solder balls. This segmentation creates multiple current pathways that reduce overall inductance, as the parallel configuration lowers the equivalent inductance compared to a single connection path
2Productivity
If operating clock frequency is increased to improve device performance, then productivity is improved, but signal integrity deteriorates due to switching noise
Solution Approach 1:
The patent changes the electrical parameters of the power delivery network by reducing inductance through interconnected bond pads, bond fingers, and solder balls. This parameter change allows the system to operate at higher clock frequencies without exceeding noise thresholds, thereby improving productivity while maintaining signal integrity
Data Source
AI summary
Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond pads on an integrated circuit die may be connected together via one or more electrically conductive interconnects.