Bond Pad Passivation Spacers for Wire Bond Integrity
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Solution Overview
Problem
The integrity of bonds between bond wires and bond pads on semiconductor devices is compromised by contamination during reliability testing, leading to potential failures and separation due to the smooth contact surface which lacks resistance to chemical interference.
Innovation Solution
A bond pad structure is created with a non-smooth contact surface comprising conductive material and passivation material, featuring spacers that form peaks and valleys, which prevents contaminant spread and enhances adhesion by using passivation material to form spacers on the surface of conductive material before depositing a conductive layer, thereby creating a robust and durable bond.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a smooth contact surface is used on bond pads, then manufacturing is easier, but adhesion and resistance to contaminant spread are reduced
Solution Approach 1:
The patent applies curvature by forming a non-planar contact surface with peaks and valleys instead of a smooth flat surface. This curved/topographic structure increases the surface area and creates mechanical interlocking features that enhance adhesion and resist contaminant spread, directly resolving the contradiction between ease of manufacture and bond integrity.
Solution Approach 2:
The patent applies local quality by creating regions of different heights (peaks and valleys) on the contact surface. These localized topographic variations provide enhanced adhesion at peak regions and contaminant trapping in valley regions, allowing the surface to simultaneously achieve good adhesion and contamination resistance without compromising manufacturing feasibility.
2Ease of operation
If passivation material is completely removed to expose bond pad, then wire bonding is easier, but contamination resistance is reduced
Solution Approach 1:
The patent applies local quality by selectively retaining passivation material in certain regions (forming peaks and valleys) while exposing conductive material in bonding regions. This localized differentiation allows the bond pad to maintain ease of wire bonding while simultaneously providing contamination resistance through the retained passivation material structure.
Solution Approach 2:
The patent uses the passivation material structure as an intermediary element that mediates between the need for easy wire bonding and contamination resistance. The non-planar passivation material creates peaks and valleys that facilitate wire bonding while the valleys trap contaminants, allowing both requirements to be satisfied simultaneously.
3Reliability
If a non-smooth surface with spacers is created, then adhesion and contaminant resistance are improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies curvature by forming a non-planar contact surface through standard semiconductor fabrication processes. While this creates a more complex surface topology, it significantly enhances bond integrity and contaminant resistance. The complexity is managed by using established fabrication techniques rather than introducing entirely new manufacturing steps.
Solution Approach 2:
The patent uses composite materials by combining conductive material (bond pad) with passivation material (spacers) to create a structured contact surface. This composite structure provides both the electrical conductivity needed for bonding and the mechanical/chemical properties needed for adhesion and contamination resistance, achieving improved reliability without excessive manufacturing complexity.
Data Source
AI summary
A method includes forming a pad on an electronic component. The pad comprises conductive material. The method further includes providing passivation material on a surface of the conductive material and removing passivation material from the surface to expose portions of the conductive material to form a bond pad comprising conductive material and passivation material.