Bond Pad Layout for Passive Device Pattern Loading Relief
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Solution Overview
Problem
The presence of bond pads over passive devices in semiconductor chips adversely impacts the performance of these devices and the connected circuits due to pattern loading effects, which are exacerbated by high pattern density differences between functional and passive device zones.
Innovation Solution
The arrangement of bond pads is optimized by reducing the pattern density in the passive device zone and introducing a transition zone with intermediate pattern density between the passive and functional zones, mitigating the pattern loading effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If bond pads are formed over passive devices to provide connectivity, then electrical connection is improved, but device performance deteriorates due to pattern loading effects
Solution Approach 1:
The patent applies local quality by creating different pattern densities in different zones: the passive device zone has a first pattern density, the functional circuit zone has a second pattern density, and the transition zone has a third pattern density that is intermediate between the first and second. This gradient distribution optimizes each zone's characteristics - maintaining device performance in the passive zone while ensuring connectivity in the functional zone, with the transition zone mitigating adverse effects between them.
2Ease of operation
If high pattern density is used in functional circuit zone to ensure connectivity, then electrical connection is improved, but pattern loading effect increases and adversely impacts passive devices
Solution Approach 1:
The transition zone acts as an intermediary between the passive device zone and the functional circuit zone. It has a pattern density that is intermediate between the two zones, serving as a buffer that mitigates the pattern loading effect while maintaining electrical connectivity. This intermediate zone reduces the adverse impact of high pattern density on passive devices.
3Ease of manufacture
If uniform pattern density is used across the entire chip, then manufacturing simplicity is maintained, but both device performance and connectivity are compromised
Solution Approach 1:
Instead of uniform pattern density, the patent implements local quality variations with three distinct zones having different pattern densities. The passive device zone, functional circuit zone, and transition zone each have optimized pattern densities suited to their specific functions, improving overall device performance while the gradient transition maintains manufacturing feasibility.
Data Source
AI summary
A method includes forming a function circuit on a semiconductor substrate of a device die, wherein the function circuit is in a functional circuit zone of the device die, forming a passive device over the semiconductor substrate, wherein the passive device is in a passive device zone of the device die, forming a first plurality of bond pads in the functional circuit zone and at a surface of the device die, wherein the first plurality of bond pads have a first pattern density; and forming a second plurality of bond pads in the passive device zone and at the surface of the device die. The second plurality of bond pads have a second pattern density lower than the first pattern density.