Bond Pad Sharing for Magnetic Recording Head Heaters
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Solution Overview
Problem
The challenge in magnetic recording heads is the limited number of bond pads available, which complicates the electrical connection and powering of increasing numbers of components, especially in heat-assisted magnetic recording (HAMR) and interlaced magnetic recording (IMR) systems, leading to issues like bias contention and degraded performance.
Innovation Solution
The implementation of bond pad sharing between electrical components with similar biasing requirements, utilizing diodes to control current flow based on operational modes, allows for the reduction of bond pad count by sharing existing pads between multiple components, thereby freeing up additional pads for other uses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of components in magnetic recording head increases to support HAMR and IMR systems, then the functionality and performance are improved, but the number of available bond pads becomes insufficient
Solution Approach 1:
The patent applies bond pad sharing where a single bond pad is electrically connected to multiple components through diodes. The same bond pad serves multiple functions by providing power to different components at different times, controlled by the directional conductivity of diodes. This multi-functionality resolves the contradiction between increasing component count and limited bond pad availability.
Solution Approach 2:
The patent implements dynamic bond pad allocation where the electrical connection between a bond pad and components changes based on operational mode. Diodes enable the bond pad to dynamically connect to different components during different operating phases (e.g., heating mode vs. recording mode), allowing the system to support more components than the static number of bond pads would suggest.
2Device complexity
If bond pads are shared between multiple components, then the number of required bond pads is reduced, but bias contention and ground noise interference may occur
Solution Approach 1:
The patent introduces diodes as intermediary components between the shared bond pad and multiple components. These diodes act as mediators that control current flow direction, preventing simultaneous conflicting currents from different components. The diode's unidirectional conductivity ensures that only one component receives power at a time, eliminating bias contention while maintaining bond pad sharing.
Solution Approach 2:
The patent converts the potential harm of ground noise and bias contention into a beneficial control mechanism. By strategically placing diodes in the circuit paths, the design uses the diode's inherent properties to block harmful reverse currents and ground noise from affecting other components, while still allowing the shared bond pad to serve multiple functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the number of bond pads required, simplifies the design, and maintains performance by preventing ground noise interference and ensuring proper signal directionality, thus addressing the complexity and space constraints in magnetic recording heads.
Implementation Method 1
A first diode is disposed on the slider and coupled in series with the first heater. A second diode is disposed on the slider and coupled in series with the second heater.
Implementation Method 2
A first heater of the slider is coupled between the first bond pad and the ground pad. The first heater is situated proximate the first writer and configured to thermally actuate the first writer.
Data Source
AI summary
A slider of a magnetic recording head comprises a ground pad and a plurality of electrical bond pads coupled to bias sources. A component of the slider is coupled between first and second bond pads. A first heater of the slider is coupled between the first bond pad and the ground pad. A second heater of the slider is coupled between the second bond pad and the ground pad. A first diode is disposed on the slider and coupled in series with the first heater. A second diode is disposed on the slider and coupled in series with the second heater.