Bond Pad Connector Structure for Stretchable Joint Stress Relief
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Solution Overview
Problem
Interconnecting joints in wearable technology, such as smart clothing systems, are prone to damage due to mechanical strains from bending, stretching, and twisting, leading to reduced lifespan.
Innovation Solution
A bond pad connector with spaced apart bond pads featuring stress relieve components and extension components, designed for secure attachment of electronic components on a stretchable substrate, which absorb mechanical strains through deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If SMDs are embedded in e-textiles via interconnecting joints, then wearable technology functionality is achieved, but the interconnecting joints are damaged by mechanical strains from bending, stretching, and twisting movements
Solution Approach 1:
The bond pad connector is divided into distinct functional segments: bond pads for electrical connection, stress relieve components for mechanical stress management, and extension components for structural support. This segmentation allows each part to perform its specific function optimally while reducing overall stress on the interconnecting joint.
Solution Approach 2:
The stress relieve component with its central hole and extension component is designed beforehand to absorb and distribute mechanical stresses before they can damage the interconnecting joint. This pre-cushioning structure protects the bond pads and conductive traces from the harmful effects of bending, stretching, and twisting movements.
2Ease of manufacture
If conventional bond pads are used on stretchable substrates, then electronic component connection is achieved, but stress concentration damages the conductive traces and reduces lifespan
Solution Approach 1:
The stress relieve component introduces a dimensional feature with its central hole, transforming the bond pad structure from a flat two-dimensional connection to a three-dimensional stress-distributing structure. This dimensional change allows stress to be distributed across multiple planes rather than concentrated at a single point.
Solution Approach 2:
The stress relieve component acts as an intermediary element between the bond pad and the extension component, mediating the transmission of mechanical stresses. This intermediary structure absorbs and redistributes stresses before they reach the conductive traces, preventing stress concentration and extending connector lifespan.
3Device complexity
If bond pads are directly connected to conductive traces without stress relief structures, then simple manufacturing is achieved, but mechanical strains cause joint damage and reduced system lifespan
Solution Approach 1:
The stress relieve component with its central hole and extension component introduces dynamic stress distribution capabilities to the bond pad structure. Instead of a static, rigid connection, the structure can now dynamically respond to mechanical strains by distributing stresses across different regions, maintaining reliability under varying mechanical conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bond pad connector significantly reduces stress on the joint between the electronic component and conductive trace, enhancing the durability and lifespan of the electronic components under mechanical strain.
Implementation Method 1
the stress relieve component being formed with a central hole, and an extension component extending from the stress relieve component and opposite to the conductive trace
Data Source
AI summary
A bond pad connector to be disposed on a stretchable substrate and adapted to secure an electronic component thereon. The bond pad connector includes two spaced apart bond pads that are adapted to be disposed on the stretchable substrate to face each other. Each of the two bond pads is adapted to be connected to a respective conductive trace and includes: a stress relieve component that is adapted to be connected to the conductive trace, the stress relieve component being formed with a central hole; and an extension component extending from the stress relieve component and opposite to the conductive trace. The electronic component is secured onto the bond pad connector by attaching the electronic component to, for each of the bond pads, at least a part of the extension component.