Bond Surface Testing Apparatus Using Microfluidic Pipettes

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Solution Overview

Problem

Current methods lack the ability to quantify and certify the bonding surface quality of structural composite materials before bonding, leading to potential poor bonding quality and increased waste due to the inability to assess the readiness of bonding surfaces for long-term structural durability and strength.

Innovation Solution

A bond surface testing apparatus that activates surface energies on the bonding surface using solutions dispensed via microfluidic pipettes, analyzing properties through complex mathematical algorithms to calculate a quality bonding factor indicating suitability for bonding, which includes a solution chamber, microfluidic pipettes, and an information capture module to assess three-dimensional wettability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional surface measurement methods (profilometry, XPS) are used to characterize bonding surfaces, then surface roughness or active contaminants can be measured, but the bonding surface cannot be quantified in terms of readiness to meet long-term structural joint durability and strength

Engineering Contradiction:

Improvebonding surface quality quantificationVSAvoidlong-term structural joint durability

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent introduces an intermediary substance (liquid or gas) that interacts with the bonding surface to reveal its properties. The contact angle measurement of this intermediary on the surface serves as a mediator between the surface characteristics and the quantifiable bonding quality metric, enabling indirect but reliable assessment of bonding readiness

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the measurement parameter from direct physical surface properties (roughness, composition) to a functional parameter (contact angle) that reflects the surface's actual bonding performance. This parameter transformation enables correlation between measurement data and long-term structural durability

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If tight process controls and technician skill are relied upon to ensure bonding surface quality, then some consistency can be achieved, but quantifiable engineering data and certification of bonding surface readiness are not obtained

Engineering Contradiction:

Improvebonding surface quality consistencyVSAvoidquantifiable engineering data

Core Design Contradiction:

Manufacturing precisionVSLoss of information

Solution Approach 1:

The patent implements a feedback mechanism where the contact angle measurement provides immediate, quantifiable information about bonding surface quality. This feedback loop replaces reliance on technician experience with objective data that can guide process adjustments and provide certification of bonding readiness

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent substitutes the mechanical/manual assessment method (technician inspection and judgment) with an automated measurement system that uses contact angle analysis. This replacement eliminates subjectivity and generates quantifiable engineering data for bonding surface certification

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If conventional bonding surface preparation methods (hand sanding, grit blasting, laser techniques) are used, then surface preparation can be performed, but wide variations in measured results occur

Engineering Contradiction:

Improvebonding surface preparationVSAvoidbonding surface quality measurement

Core Design Contradiction:

Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent performs preliminary action by measuring the contact angle immediately after surface preparation but before bonding. This early measurement allows assessment of whether the preparation method achieved the desired surface quality, enabling corrective action before the bonding process begins

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus provides a quantifiable method to determine the bonding suitability of structural composite surfaces, ensuring durable bonds and reducing waste by certifying the bonding surface quality before structural bonding, thus enhancing the reliability of composite structures.

Implementation Method 1

measuring characteristics of a bonding surface via surface energies that are activated on the bonding surface

Methodology Applied

Scientific EffectSurface energy activation: Surface Tension

Implementation Method 2

three-dimensional wettability surface energies of the bonding surface

Methodology Applied

Scientific EffectWettability: Wetting

Data Source

PatentUS9372148B2Bond surface testing apparatus and method

Publication Date: 2016.06.21 THE BOEING CO

AI summary

A bond surface testing apparatus and method are presented. The bond surface testing apparatus comprises a solution chamber; a plurality of solution containers located in the solution chamber; a plurality of microfluidic pipettes; and an information capture module. Each solution container in the plurality of solution containers includes a microfluidic pipette in the plurality of microfluidic pipettes. A number of the plurality of microfluidic pipettes has a non-circular cross-section. The information capture module is physically associated with the solution chamber and is configured to capture information relating to bonding surface properties of the bonding surface.