Bond Wire Antenna for IC Die Millimeter Wave Integration
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Solution Overview
Problem
The development of millimeter wave devices is hindered by difficulties in designing radiating structures and forming interconnects between integrated circuits and antennas, particularly due to interconnect discontinuities and the high cost and complexity of fabricating efficient antenna structures.
Innovation Solution
The use of bond wires as radiating elements coupled to integrated circuit dies via wire bonding techniques eliminates the need for interconnects between the integrated circuit and a remotely positioned antenna, forming a dipole or folded dipole antenna structure that is cost-effective and efficiently operates at millimeter wave frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If planar antennas (microstrip or patch) are printed on a circuit board, then antenna integration is achieved, but interconnect discontinuities occur due to extremely short millimeter wave wavelengths
Solution Approach 1:
The patent merges the antenna radiating structure with the bond wire interconnect by forming the antenna pattern directly on the circuit board using conductive ink that is applied along the bond wire path. This integration eliminates the discontinuity between separate interconnect and antenna structures, allowing the bond wire to serve dual purposes as both electrical interconnect and radiating element.
Solution Approach 2:
The antenna pattern is formed on the circuit board before the IC die is mounted and bonded. The conductive ink pattern is applied in advance along where the bond wires will be placed, creating a pre-configured radiating structure that will be electrically connected to the IC die through the bond wires, thereby eliminating subsequent interconnect discontinuities.
2Ease of manufacture
If planar antennas are printed on the circuit board, then antenna fabrication is simplified, but valuable real estate on the circuit board is consumed
Solution Approach 1:
The patent utilizes the three-dimensional space above the circuit board by having the bond wires extend vertically from the IC die to form the antenna radiating structures. This vertical dimension allows the antenna pattern to be formed in the air space above the board rather than consuming board surface area, effectively moving the antenna from a two-dimensional plane to a three-dimensional configuration.
3Adaptability or versatility
If wire antennas or cavity antennas are used as alternatives to printed-circuit patch antennas, then bandwidth is broadened and substrate real estate is reduced, but fabrication difficulty increases
Solution Approach 1:
The patent employs standard wire bonding equipment and processes that are already widely used in the electronics industry to create the antenna structures. The existing bond wire infrastructure and bonding techniques serve the dual purpose of electrical interconnection and antenna formation, eliminating the need for specialized fabrication equipment or processes while achieving the desired antenna performance characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution eliminates interconnect discontinuities, allows for small, cost-effective fabrication of millimeter wave antennas, and achieves higher antenna gain and bandwidth, significantly improving the performance and efficiency of millimeter wave devices.
Implementation Method 1
bond wires as radiating elements coupled to integrated circuit dies that efficiently operate at millimeter wave frequencies
Data Source
AI summary
A device 20 includes a substrate 22 having an integrated circuit (IC) die 24 coupled thereto. A bond wire 28 interconnects a die bond pad 32 on the IC die 24 with an insulated bond pad 36. Another bond wire 38 interconnects a die bond pad 42 on the IC die 24 with another insulated bond pad 46. The bond wires 28 and 38 serve as radiating elements of a dipole antenna structure 64. A reflector 72 and director 74 can be located on the substrate 22 and/or the IC die 24 to reflect and/or direct a radiation pattern 66 emitted by or received by the antenna structure 64. A trace 82 can be interconnected between the insulated bond pads 36, 46 to form a folded dipole antenna structure 84.