Bond Wire Antenna for Compact IC Packaging
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Solution Overview
Problem
Antennas implemented on integrated circuits or printed circuit boards occupy a large area, and connections to these antennas can negatively impact performance due to parasitic inductance or capacitance.
Innovation Solution
A bond wire antenna structure is used, where a bond wire connects pads on a chip and a substrate, functioning as the main element of the antenna, allowing for compact design and efficient electromagnetic signal transmission or reception, with the bond wire and pads made from conductive materials like copper or aluminum, and a ground plane aiding in signal reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a traditional antenna is implemented on an integrated circuit or printed circuit board, then the antenna can transmit or receive electromagnetic signals, but it occupies a relatively large area
Solution Approach 1:
The patent merges the antenna structure with the bond wire packaging interconnect structure. The bond wire is configured to extend beyond the chip body to form an antenna element, combining the packaging interconnect function with the antenna radiation function into a single integrated structure, thereby eliminating the need for separate antenna components and reducing overall area.
Solution Approach 2:
The bond wire serves dual functions: as a packaging interconnect for electrical connection between chip and substrate, and as an antenna element for electromagnetic signal transmission. This multi-functionality allows the same structure to fulfill both packaging and communication requirements, reducing the area needed for dedicated antenna components.
2Device complexity
If connection components are added to the antenna, then the antenna can be integrated with the circuit, but parasitic inductance or capacitance negatively impacts antenna performance
Solution Approach 1:
The patent eliminates separate connection components by merging the antenna element directly with the bond wire interconnect. The bond wire itself serves as the radiating element, removing the need for additional connectors, transition structures, or intermediate components that would introduce parasitic effects, thereby maintaining signal integrity while achieving integration.
Solution Approach 2:
The patent extracts and eliminates the harmful connection components (such as separate feed structures, transitions, and intermediate connectors) from the antenna system. By using the bond wire directly as the antenna element, the design removes the sources of parasitic inductance and capacitance while retaining the essential function of electrical connection and signal radiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bond wire antenna structure effectively reduces chip area usage, provides a cost-effective packaging solution, and enhances antenna performance by optimizing signal transmission and reception across various frequencies, such as 10 GHz or 60 GHz, while minimizing parasitic effects.
Implementation Method 1
The at least one bond wire is configured to transmit or receive an electromagnetic wave signal
Implementation Method 2
a ground plane aiding in signal reflection
Data Source
AI summary
An antenna structure includes a substrate having at least one first pad for wire bonding. A chip is mounted on the substrate, and the chip has at least one second pad for wire bonding. At least one bond wire connects the at least one first pad and the at least one second pad. The at least one bond wire is configured to transmit or receive an electromagnetic wave signal in at least one specified frequency for data communication.