Bond Wire Array Grounding Structures for Signal Isolation
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Solution Overview
Problem
Signal crosstalk in integrated circuit packages with wireless communication components, such as RF or mmW receivers and transmitters, is not adequately isolated by existing extended ground planes, which often require costly precise placement and achieves insufficient isolation of approximately −35 decibels.
Innovation Solution
The implementation of Bond Wire Array (BWA) structures in a fan out region of a fan out wafer level package to confine electromagnetic fields and isolate signals between communication ports, with grounding structures positioned around communication ports and connected to a substrate ground plane, allowing for customizable height, length, and orientation to achieve better signal isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an extended ground plane (EGP) is used to isolate signals between communication ports, then signal isolation is improved, but manufacturing cost increases due to costly precise placement and alignment requirements
Solution Approach 1:
The extended ground plane is segmented into multiple discrete ground structures positioned around the communication ports. These segmented ground structures are connected to the ground plane through vias, creating isolation regions without requiring a continuous, precisely aligned EGP. This segmentation reduces manufacturing complexity and cost while maintaining signal isolation effectiveness.
2Reliability
If an extended ground plane (EGP) is used to isolate signals, then some isolation is achieved, but the placement and alignment must be precisely controlled adding to package cost
Solution Approach 1:
The continuous EGP is divided into discrete ground structures that can be independently positioned and connected to the ground plane through vias. This segmentation relaxes the alignment requirements compared to a continuous EGP, as each ground structure can be separately placed and connected, reducing the overall manufacturing precision requirements and associated costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves improved signal isolation performance, exceeding the −35 decibels requirement across a range of frequencies, providing better isolation than traditional extended ground planes, with customizable configurations for specific frequency ranges.
Implementation Method 1
grounding structures positioned around communication ports and connected to a substrate ground plane, allowing for customizable height, length, and orientation to achieve better signal isolation
Data Source
AI summary
A packaged semiconductor device includes a substrate having a ground plane, a first communication port on the substrate, a second communication port on the substrate adjacent the first communication port, and grounding structures on the substrate. Each of the grounding structures is in contact with two different locations on the ground plane and is adjacent to one of the first and second communication ports. An electrically insulating material completely covers a top side of each of the grounding structures.