Bond-Wire Inductor Structure for Low-Resistance Surface Mounting

The inductive device is segmented into multiple conductive structures (first conductive structure, second conductive structure, third conductive structure, fourth conductive structure) that form separate coil windings. Each conductive structure is independently formed and then interconnected through conductive vias to create the complete inductor. This segmentation allows for simplified manufacturing of individual components while achieving low DC resistance through the integrated multi-structure design.

The inductive device merges multiple conductive structures into a single integrated component that can be surface mounted as one unit. The first, second, third, and fourth conductive structures are interconnected through conductive vias to form a unified inductor with low DC resistance. This merging approach maintains SMD form factor compatibility while reducing manufacturing cost through integration and simplified assembly processes.

The conductive structures utilize three-dimensional routing with conductive vias that extend vertically through the substrate, transitioning the design from a purely two-dimensional surface layout to a three-dimensional structure. This dimensional change allows the magnetic flux to be confined within a smaller footprint area while maintaining high inductance through the vertical component of the magnetic path, thus meeting SMD form factor requirements.