Off-Substrate Bond Wire Kinking for Microcontact Arrays
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Solution Overview
Problem
Conventional etching processes are limited in forming microcontacts with a high aspect ratio and small pitch, making it difficult to create arrays of microcontacts with appreciable height and small spacing between adjacent contacts, which is essential for high-speed microelectronic packaging.
Innovation Solution
A method using a bonding tool to form electrically conductive leads by bonding a wire to a metal surface, clamping it, and then using the tool to impart a kink and break the wire, creating a lead that extends from the surface to a defined end, allowing for the formation of leads with varying shapes and movements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etching processes are used to form microcontacts, then the manufacturing process is simple, but the aspect ratio and pitch control are limited
Solution Approach 1:
The patent replaces the conventional etching process (chemical/mechanical system) with a wire bonding system that uses mechanical forces (tension, compression, bending) to form microcontacts. The bonding tool applies controlled mechanical forces to the wire to create spherical contacts with precise aspect ratios and pitches that cannot be achieved through etching alone.
Solution Approach 2:
The patent changes the formation mechanism from etching (removing material) to wire bonding (adding and shaping material through mechanical forces). By controlling parameters such as wire tension, bonding force, and tool movement, the system achieves precise control over microcontact aspect ratio and pitch while maintaining manufacturing feasibility.
2Adaptability or versatility
If wire bonding is used to form leads, then flexibility in shape and position control is improved, but the process complexity increases
Solution Approach 1:
The bonding tool is designed to perform multiple functions: bonding the wire to the substrate, shaping the wire into desired configurations, and creating precise microcontacts. This multi-functionality reduces the need for separate processing steps and tools, thereby managing complexity while enhancing adaptability.
Solution Approach 2:
The bonding tool employs dynamic control of wire tension and positioning during the bonding process. By adjusting these parameters in real-time, the system can create leads with varying shapes and positions, achieving high adaptability through controlled dynamic behavior rather than static tooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of electrically conductive leads with precise control over shape and position, facilitating the formation of microelectronic packages with improved interconnects for high-speed operations by providing vertical interconnects and reducing the size of microelectronic assemblies.
Implementation Method 1
bonding a wire extending beyond a surface of a bonding tool to a metal surface
Implementation Method 2
moving the bonding tool while the wire remains clamped such that the bonding tool imparts a kink to the wire
Implementation Method 3
tensioning the wire using the bonding tool such that the wire breaks at the kink to define an end
Data Source
AI summary
An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Tensioning the wire using the bonding tool causes the wire to break and define an end. The lead then extends from the metal surface to the end.