Bond Wire Solder Ball Configuration for High Current Density
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Solution Overview
Problem
The shrinking size requirements of semiconductor packages pose a challenge in maintaining adequate electrical supply to electronic components, as traditional bonding methods often require larger bond fingers to accommodate increasing electrical demands.
Innovation Solution
The use of bond pad and bond finger solder balls with strategically positioned bond wires allows for efficient electrical coupling between a die and a substrate, maximizing electrical current while minimizing bond finger size by sharing contact locations and using reverse and forward bonding configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional bonding methods are used to maintain electrical supply, then electrical current can be supplied adequately, but package size increases
Solution Approach 1:
Multiple bond wires (first bond wire, second bond wire) are combined to share a common bond finger, allowing multiple electrical connections to be merged into a single contact point on the substrate. This reduces the total number of bond fingers needed and minimizes package size while maintaining adequate electrical current supply to the die
Solution Approach 2:
The bond finger is designed to serve multiple functions by receiving multiple bond wires from different dies or different bond pads. This multi-functional bond finger structure allows a single bond finger to handle multiple electrical connections, reducing the overall number of bond fingers required and thereby reducing package size
2Volume of moving object
If bond finger size is reduced to minimize package size, then package size decreases, but electrical current capacity is reduced
Solution Approach 1:
The electrical connection path is segmented into multiple parallel bond wires (first bond wire, second bond wire) that share a common bond finger. This segmentation allows the electrical current to be distributed across multiple wire paths, increasing total current capacity while keeping the bond finger size small
Solution Approach 2:
Instead of increasing bond finger size (two-dimensional approach) to handle more current, the solution moves to a three-dimensional approach by adding multiple bond wires that share the common bond finger. This vertical stacking of multiple connection paths in the same footprint area allows increased current capacity without increasing package size
3Power
If multiple bond fingers are used to increase electrical current, then electrical current increases, but device complexity increases
Solution Approach 1:
Multiple bond wires are merged to share a single common bond finger, reducing the total number of discrete bonding structures needed. This consolidation simplifies the overall bonding structure and reduces device complexity while still providing multiple electrical current paths to meet power requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively doubles the electrical current supplied to dies while reducing the size of bond fingers, enabling smaller package sizes without compromising electrical performance.
Implementation Method 1
a first bond wire coupled between the bond pad and the bond finger, and a second bond wire coupled between the bond pad and the bond finger
Implementation Method 2
at least one of the bond wires is coupled to the bond pad with a bond pad solder ball. In some examples, both of the bond wires are coupled to the bond pad with a bond pad solder ball
Data Source
AI summary
Electronic device package technology is disclosed. In one example, an electronic device includes a substrate having a bond finger, a die coupled to the substrate and having a bond pad, a first bond wire coupled between the bond pad and the bond finger, and a second bond wire coupled between the bond pad and the bond finger. The first bond wire is reverse bonded between a pad solder ball on the bond pad and a finger solder ball on the bond finger. The second bond wire is forward bonded between a supplemental pad solder ball on the pad solder and the bond finger adjacent the finger solder ball. Associated systems and methods are also disclosed.