Bond Wire Transformer Parallel Configuration
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Solution Overview
Problem
State-of-the-art bond wire transformers face inefficiencies due to complex series connections, high resistive losses, and limited predictability of inductive component values, which hinder their use in high-power applications.
Innovation Solution
The transformer design employs a single or half-loop primary bond wire configuration with multiple loop secondary bond wires, connected in parallel to enhance magnetic coupling and turns ratio, reducing resistive losses and increasing power efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If series connections are used to achieve desired turns ratio, then transformer ratio is improved, but resistive losses increase and power efficiency deteriorates
Solution Approach 1:
The patent combines multiple bond wires in parallel configuration to achieve the desired turns ratio, rather than using series connections. This merging approach reduces the total resistance by providing multiple parallel current paths, thereby reducing resistive losses while maintaining the required transformer ratio for power transmission.
Solution Approach 2:
Instead of using the conventional series connection approach to achieve turns ratio, the patent inverts the approach by using parallel connections. This inversion fundamentally changes the electrical characteristics, reducing resistive losses while still achieving the desired transformation ratio through the geometric arrangement and magnetic coupling of the parallel bond wires.
2Reliability
If multiple bond pads are provided for each series connection, then transformer functionality is achieved, but space utilization deteriorates and device complexity increases
Solution Approach 1:
The patent merges multiple bond wire connections to share common bond pads, thereby reducing the total number of discrete bond pads required. This consolidation maintains the transformer functionality through parallel magnetic coupling while significantly reducing the spatial complexity and number of connection points needed on the substrate.
Solution Approach 2:
The bond pads in the patent serve multiple functions simultaneously - they act as electrical connections for multiple parallel bond wires, provide magnetic coupling points, and establish the transformer ratio through their geometric arrangement. This multi-functionality reduces the overall device complexity while maintaining full transformer functionality.
3Manufacturing precision
If integrated planar technology is used, then manufacturing precision is improved, but quality factor deteriorates due to substrate losses
Solution Approach 1:
The patent extracts the bond wires from the substrate plane and forms them as three-dimensional loops or coils above the substrate. This extraction removes the current paths from direct contact with the lossy substrate, eliminating substrate losses while maintaining the manufacturing precision benefits of standard bond wire fabrication techniques.
Solution Approach 2:
The patent transitions from two-dimensional planar integration to three-dimensional bond wire structures. By forming vertical loops and coils above the substrate, the current paths occupy a different spatial dimension, reducing coupling with substrate losses while preserving the precision of automated wire bonding manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in high-quality, high-power transformers with quality factors exceeding 100 at 2.14GHz, overcoming the limitations of integrated planar transformers and enabling efficient high-frequency applications like outphasing amplifiers and power combiners.
Implementation Method 1
each individual pair of adjacent primary and secondary bond wires form a transformer due to the magnetic coupling between them
Implementation Method 2
A first set of primary bond wires (1) connected in parallel between first and second metal bonding bars (2, 3). Similarly, a second set of secondary bond wires (4) connected in parallel between third and fourth metal bonding bars (5, 6)
Data Source
Figure 1
Figure 2a~2c
Figure 3a~3b
AI summary
A bond wire transformer comprises a plurality of primary bond wires (1) coupled in parallel; and a plurality of secondary bond wires (4) coupled in parallel, each secondary bond wire (4) being spaced apart from and oriented relative to a corresponding primary bond wire (1) so as to achieve a desired mutual inductance between the corresponding primary (1) and secondary (4) bond wires, thereby providing magnetic coupling between the primary (1) and secondary (4) bond wires.