Bondable Metamaterial Base Material for Low-Loss THz Patterns
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Metamaterials for electromagnetic waves in the terahertz band face challenges with increased transmission loss due to reduced smoothness of the pattern surface, which affects adhesiveness between the base material and the pattern, leading to decreased performance.
Innovation Solution
A base material with a bondable compound, such as a conductive or insulator-to-conductor material, is used, featuring a dielectric loss tangent of 0.01 or less, and containing fluorine-based or liquid crystal polymers, with specific functional groups to enhance adhesiveness and pattern smoothness, while maintaining a pattern thickness less than 5 μm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the thickness of the pattern is reduced to lower cost, then the smoothness of the pattern surface is lowered, but transmission loss increases
Solution Approach 1:
The base material surface is pre-treated with a bondable compound before pattern formation to ensure high smoothness is maintained even when the pattern thickness is reduced. This preliminary preparation of the substrate prevents the usual degradation of smoothness that would occur with thin patterns, thereby preventing increased transmission loss.
Solution Approach 2:
A bondable compound is introduced as an intermediary substance between the base material and the pattern. This compound enhances the adhesiveness and maintains the smoothness of the pattern surface, allowing thin patterns to achieve the same smoothness as thicker patterns, thus reducing transmission loss.
2Loss of energy
If the smoothness of the base material surface is improved to reduce transmission loss, then the adhesiveness with the pattern decreases
Solution Approach 1:
The base material is designed with different local properties: the bulk material provides smoothness to reduce transmission loss, while the surface layer contains bondable compounds that provide high adhesiveness for pattern attachment. This spatial differentiation of material properties resolves the contradiction between smoothness and adhesiveness.
Solution Approach 2:
The base material is constructed as a composite containing both smooth material components and bondable compound components. The smooth components maintain low transmission loss, while the bondable compounds ensure strong pattern adhesiveness, allowing both requirements to be satisfied simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a metamaterial with improved adhesiveness between the base material and pattern, reducing transmission loss and maintaining performance in the terahertz band, while ensuring excellent adhesiveness and mechanical properties.
Implementation Method 1
a bondable compound with at least one of a conductive material or a material which transits from an insulator to a conductor
Implementation Method 2
a dielectric layer having a specific gravity of 0.01 or less
Data Source
AI summary
Provided are a base material for a metamaterial, containing a bondable compound with at least one of a conductive material or a material which transits from an insulator to a conductor; and a metamaterial and a laminate including the base material for a metamaterial.