Bonded Article Heat-Blocking Structure for Local Adhesive Curing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for bonding members with high thermal conductivity using thermosetting adhesives face challenges such as difficulty in local heating, material selection limitations, dimensional changes due to thermal expansion, increased production time, and energy inefficiency, particularly when using continuous heating furnaces.
Innovation Solution
A bonded article and production method featuring a first member with high thermal conductivity and a second adhering member, where a heat transfer-inhibiting structure, such as concave grooves or separate thermal conductivity regions, is used to inhibit heat transfer from the heat-inputting portion to the peripheral areas, allowing for localized and efficient curing of the thermosetting adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a continuous heating furnace is used to cure the thermosetting adhesive, then the adhesive can be cured, but the production time increases and energy efficiency decreases
Solution Approach 1:
The patent divides the heating process into localized zones by introducing heat only at specific positions (heat-inputting portions) rather than heating the entire workpiece uniformly. This segmentation allows curing to occur only where needed, reducing overall processing time and energy consumption while maintaining reliable adhesive curing.
Solution Approach 2:
The patent applies heat locally to specific regions (heat-inputting portions) where the adhesive requires curing, rather than heating the entire workpiece. This local quality approach enables targeted curing that reduces production time and energy usage while ensuring adequate adhesive bonding at critical locations.
2Reliability
If the entire workpiece is heated for adhesive curing, then the adhesive cures properly, but material selection is limited due to heat resistance requirements
Solution Approach 1:
By segmenting the heating process to apply heat only at specific heat-inputting portions, the patent reduces the overall thermal load on the workpiece. This allows selection of materials with lower heat resistance that would be unsuitable for full-workpiece heating, thereby expanding material versatility while still achieving reliable adhesive curing at the heated locations.
Solution Approach 2:
The patent applies heat locally rather than uniformly across the entire workpiece, creating a temperature gradient where only specific regions reach curing temperatures. This local quality approach enables the use of materials with lower thermal stability in non-heated regions, significantly broadening material selection flexibility while maintaining adequate adhesive curing performance.
3Reliability
If the entire workpiece is heated for adhesive curing, then the adhesive cures, but dimensional changes occur due to thermal expansion causing misalignment
Solution Approach 1:
The patent segments the heating process to apply heat only at specific heat-inputting portions rather than uniformly heating the entire workpiece. This segmentation minimizes overall thermal expansion and contraction, reducing dimensional changes and preventing misalignment issues while still achieving reliable adhesive curing at the heated locations.
Solution Approach 2:
By applying heat locally to specific regions rather than uniformly across the entire workpiece, the patent creates controlled thermal zones that minimize overall dimensional changes. This local quality approach reduces thermal expansion-induced misalignment while ensuring adequate adhesive curing at the heated portions, thereby improving manufacturing precision.
4Reliability
If a continuous heating furnace is used for adhesive curing, then the adhesive can be cured, but production space efficiency decreases
Solution Approach 1:
The patent extracts the heating function from a large continuous furnace and concentrates it into localized heat-inputting portions. This extraction eliminates the need for extensive heating equipment and large production spaces, while still achieving reliable adhesive curing through targeted local heating.
Solution Approach 2:
The patent replaces the mechanical continuous heating furnace system with a more compact localized heating approach. This substitution reduces the spatial requirements for production equipment and space while maintaining effective adhesive curing through concentrated heat application at specific portions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables quick and energy-efficient thermal curing of the adhesive, reducing misalignment and quality issues, while allowing for the use of materials with lower heat resistance and improving production flexibility and cost-effectiveness.
Implementation Method 1
the first member has a heat transfer-inhibiting structure that inhibits transfer of heat from a heat-inputting portion into which heat is introduced to a peripheral portion
Implementation Method 2
a heat-inputting step of introducing heat from a surface of the first member different from an application surface of the adhesive toward an application region of the adhesive
Implementation Method 3
the adhesion portion that is formed of a cured product of a thermosetting adhesive
Data Source
AI summary
In order to thermally cure a thermosetting adhesive quickly and with less energy, the bonded article (10) according to the present invention comprises an adherend member (1) having a thermal conductivity of 1 w/m·K or more, an adherend member (2) made of a material which can adhere to the adherend member (1), and an adhesion portion that is formed of a cured product of a thermosetting adhesive (3) and that is in contact with both the adherend member (1) and the adherend member (2), wherein the adherend member (1) has a heat transfer-inhibiting structure (4) which inhibits the transfer of heat from a portion thereof in contact with the adhesive (3) to a peripheral portion thereof.