Bonded Assembly Spacer Design for Short-Circuit Prevention
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Solution Overview
Problem
Existing electronic packaging techniques face challenges in maintaining reliable connections between components, particularly in reducing resistance and preventing short-circuits in densely packed electronic devices.
Innovation Solution
A bonded assembly is created using a conductive bonding layer and spacers, where the spacers have a thickness greater than the sum of the heights of the electrodes, ensuring a gap for the bonding layer and preventing over-pressing, which reduces the risk of short-circuits and maintains connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes are pressed closely together to reduce resistance, then electrical connection quality improves, but the risk of short-circuits between adjacent electrodes increases
Solution Approach 1:
A spacer is introduced as an intermediary element between adjacent electrodes. The spacer physically separates the electrodes while allowing the bonding layer to fill the gap, thereby maintaining low resistance connection while preventing direct contact that would cause short-circuits.
Solution Approach 2:
The bonding layer is applied locally in the pressed area between electrodes, while the spacer provides localized separation only where needed. This allows optimized electrical contact at the electrode interface while maintaining isolation where the spacer is present.
2Strength
If pressure is applied to bond electrodes together, then connection strength improves, but the risk of deforming or damaging components increases
Solution Approach 1:
The spacer is placed beforehand between the electrodes before bonding pressure is applied. It acts as a cushion that distributes the pressure uniformly and prevents excessive deformation or damage to the electrodes and underlying components during the bonding process.
Solution Approach 2:
The spacer changes the pressure distribution parameters during bonding, transforming concentrated point loads into distributed area loads. This allows achieving sufficient bonding strength while maintaining component integrity through controlled pressure parameters.
3Object-affected harmful factors
If spacers are placed to prevent short-circuits, then safety improves, but the gap between electrodes increases which may raise resistance
Solution Approach 1:
The bonding layer serves as a conductive intermediary that fills the gap created by the spacer. It provides a low-resistance electrical path between the electrodes while the spacer maintains the physical separation needed to prevent short-circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces resistance between connection electrodes and minimizes the risk of short-circuits, enhancing the reliability and uniformity of connections in electronic devices.
Implementation Method 1
a conductive bonding layer disposed between the first electrode and the second electrode and configured to bond the first electrode and the second electrode
Implementation Method 2
at least one spacer disposed between the first substrate and the second substrate to overlap the pressed area, the at least one spacer having a thickness that is greater than a sum of the first height and the second height
Data Source
AI summary
A bonded assembly including: a first electronic component including a first substrate and a plurality of first electrodes disposed in a pressed area at a first height from a surface of the first substrate; a second electronic component including a second substrate and a plurality of second electrodes disposed at a second height from a surface of the second substrate, a second electrode overlapping with a corresponding first electrode to face the first electrode; a conductive bonding layer disposed between the first electrode and the second electrode overlapped with each other to bond the first electrode and the second electrode; and at least one spacer disposed between the first substrate and the second substrate to overlap the pressed area, the at least one spacer having a thickness that is greater than a value obtained by summing the first height and the second height.