Bonded Assembly With Vacuum Sealed Space For Marine Environments
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Solution Overview
Problem
Existing bonding methods, such as welding and adhesive application, face challenges in aggressive environments, particularly in marine settings, due to temperature control issues, environmental incompatibilities, and the difficulty in ensuring long-term adhesive durability and structural integrity.
Innovation Solution
A method involving a depression in the installation device to control humidity and pressure conditions, allowing for optimal bonding by reducing pressure below the saturated vapor pressure of water, injecting adhesive after pressure reduction, and applying a test force to ensure bonding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If welding is used to bond metal element to metal substrate, then bonding strength is improved, but temperature control becomes problematic and environmental safety deteriorates
Solution Approach 1:
The patent changes the bonding mechanism from thermal (welding) to mechanical/chemical (suction cup bonding), fundamentally altering the parameters involved in the bonding process to eliminate thermal hazards in flammable environments
Solution Approach 2:
The patent replaces the thermal welding process with a mechanical suction-based bonding system, where a suction cup creates a vacuum to bond the connector to the substrate without generating heat or sparks
2Strength
If welding is used to bond metal element to metal substrate, then bonding strength is improved, but time consumption increases due to repainting requirements
Solution Approach 1:
The patent replaces welding with suction cup bonding, eliminating the need for post-bonding repainting operations and significantly reducing total process time while maintaining bonding effectiveness
3Object-affected harmful factors
If adhesive bonding is used to connect element to substrate, then environmental safety is improved, but bonding reliability deteriorates in aggressive environments
Solution Approach 1:
The suction cup acts as an intermediary bonding mechanism that physically connects the connector to the substrate through vacuum pressure, providing reliable bonding in marine environments without using chemical adhesives that may degrade
Solution Approach 2:
The patent changes the bonding mechanism from chemical (adhesive) to physical (vacuum suction), altering the fundamental parameters of the bonding process to ensure reliability in aggressive marine environments
4Manufacturing precision
If pressure is reduced below saturated vapor pressure of water, then humidity control is improved, but device complexity increases
Solution Approach 1:
The patent utilizes phase transition of water (liquid to vapor) by reducing pressure below saturated vapor pressure, causing moisture to evaporate from the bonding interface and improve bonding quality through controlled humidity reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures reliable and durable bonded assemblies by controlling environmental conditions, reducing humidity, and enhancing adhesive performance, even in extreme environments.
Implementation Method 1
the reduction in pressure brings a pressure within said sealed space below a saturated vapor pressure of the water
Implementation Method 2
the reduction of pressure within the sealed space below the saturated vapor pressure of water makes it possible to significantly reduce the humidity level and to vaporize the liquid water present on the internal walls of the sealed space
Implementation Method 3
a displacement of at least one surface of the installation device under the effect of a pressure difference may contribute to the displacement of the connector
Data Source
Figure 1a
Figure 1b
Figure 1c
AI summary
The present invention concerns a bonded assembly, said assembly comprising: - a substrate (102); - a connector (101, 201) comprising: - a bonding surface arranged spaced apart from the substrate (102); - a bearing area surrounding said bonding surface; - at least one seal (202) compressed between the substrate and the bearing area, said seal (202), the connector (101, 201) and the substrate (102) delimiting a sealed space (209); - a recessed overflow groove (208) formed between the bonding surface and the bearing area and forming part of the sealed space (209); and - a hardened adhesive (107) at least partially occupying said sealed space, the adhesive holding the connector on the substrate via the bonding surface.