Bonded Body Production via Dynamic Pressurization Load Control
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Solution Overview
Problem
When bonding members using temporary organic materials, decomposition gas remains at the bonded interface due to insufficient exhaustion, leading to inadequate bonding strength, either from high pressurization loads causing gas interference or low loads resulting in insufficient bonding.
Innovation Solution
A method where the pressurization load during heating is set lower than the decomposition temperature of the organic material to allow gas exhaustion, followed by increasing the load for reliable bonding, ensuring decomposition gas is rapidly removed from the interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high pressurization load is applied during bonding, then bonding strength is improved, but decomposition gas cannot be exhausted from the bonded interface
Solution Approach 1:
The pressurization load is dynamically adjusted during the bonding process. Initially, a low pressurization load is applied to allow decomposition gas to escape from the bonded interface. After gas exhaustion, the pressurization load is increased to achieve strong bonding. This dynamic adjustment resolves the contradiction between bonding strength and gas exhaustion.
Solution Approach 2:
The bonding process is divided into two stages: first, a preliminary stage with low pressurization load to exhaust decomposition gas; second, a final stage with high pressurization load to achieve strong bonding. This preliminary action of gas exhaustion before full bonding prevents gas accumulation while maintaining bonding strength.
2Object-generated harmful factors
If low pressurization load is applied during bonding, then decomposition gas can be exhausted, but bonding strength becomes insufficient
Solution Approach 1:
The pressurization load transitions from low to high during the bonding process. The low initial load enables gas exhaustion, while the subsequent high load achieves strong bonding. This dynamic progression resolves the contradiction between gas exhaustion and bonding strength.
Solution Approach 2:
Gas exhaustion is performed as a preliminary action before applying full bonding pressure. This two-stage approach ensures that decomposition gas is removed first, preventing defects, and then strong bonding is achieved in the second stage.
3Strength
If constant high pressurization load is applied throughout heating, then bonding strength is improved, but decomposition gas remains trapped at the interface
Solution Approach 1:
The pressurization load is made dynamic rather than constant. It starts low during heating to allow gas escape, then increases after gas exhaustion. This dynamic control prevents gas trapping while achieving strong, reliable bonding.
Solution Approach 2:
Gas exhaustion is performed as a preliminary action before final bonding. This prevents gas entrapment that would compromise bonding quality, while still achieving high bonding strength in the subsequent high-load stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables stable bonding between members by ensuring decomposition gas is effectively exhausted, preventing bonding defects and achieving strong, reliable connections.
Implementation Method 1
the organic material of the temporary bonding material is decomposed by heating to produce decomposition gas
Implementation Method 2
pressurizing and heating the laminated body in a laminating direction
Implementation Method 3
pressurizing and heating the laminated body in a laminating direction
Data Source
AI summary
A method for producing a bonded body includes: a laminating step of forming a laminated body in which a first member and a second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member; and a bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other. In the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P2 at a decomposition temperature TD of the organic material included in the temporary bonding material is lower than a pressurization load P1 at the bonding temperature.