Bonded Body Solder Placement for Filler Residue Control
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Solution Overview
Problem
Existing bonded bodies face reliability issues due to filler residue at the bonding interface, which degrades the integrity of the bonded structure, particularly when using thermal press-bonding methods with inorganic fillers.
Innovation Solution
A bonded body design featuring a first base body with a first electrode and passivation layer, and a second base body with a second electrode, where solder is strategically placed between regions of the electrodes to prevent filler residue, ensuring high reliability by controlling the solder's flow and spread during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermal press-bonding method with inorganic filler is used, then bonding strength is improved, but filler residue at bonding interface degrades reliability
Solution Approach 1:
The patent extracts and removes the harmful inorganic filler from the bonding interface by using a solder bonding method instead of thermal press-bonding with filler. The solder acts as an intermediary material that bonds the electrodes without leaving residual filler at the bonding interface, thereby eliminating the source of reliability degradation while maintaining bonding strength.
Solution Approach 2:
The patent introduces solder as an intermediary material between the first electrode and second electrode. This solder layer serves as a mediator that achieves reliable bonding without requiring inorganic filler, thus preventing filler residue issues while maintaining strong electrical and mechanical connection.
2Reliability
If solder is used for bonding, then reliability is improved by preventing filler residue, but solder spread must be controlled to maintain bonding precision
Solution Approach 1:
The patent applies local quality control by configuring the solder to be disposed between specific regions of the first electrode and the second electrode. This localized solder placement ensures that solder flow is controlled in specific areas, preventing excessive spread while maintaining reliable bonding at the intended locations, thus balancing reliability improvement with manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of the bonded body by preventing solder spread and ensuring a clean bonding interface, thereby improving the structural integrity and performance of the bonded assembly.
Implementation Method 1
bringing the first electrode and the second electrode into contact with each other, with solder disposed on the second electrode being melted
Implementation Method 2
a first electrode of a first base body and a second electrode of a second base body are bonded to each other by solder
Data Source
AI summary
A bonded body includes: a first base body including a first wiring, a first electrode made of an electroplating film and including a first surface having a first region covering a periphery of an end portion of the first wiring and a second region covering the end portion of the first wiring, and a first passivation layer made of an insulating material and covering a periphery of the first electrode; a second base body including a second electrode; and solder disposed between the first region of the first electrode and the second electrode.