Semiconductor Bonded Connector Alignment Using Overlay Inspection
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Solution Overview
Problem
The implementation of 3DIC technology faces challenges in precise alignment of vertical connections between electronic components, leading to potential bonding issues and electrical problems.
Innovation Solution
A method for inspecting semiconductor bonded structures by obtaining images of conductive connectors on different semiconductor structures, deriving overlay images, and performing alignment evaluations to adjust or replace misaligned connectors before bonding, ensuring compliance with design rules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If 3DIC technology is implemented to integrate multiple layers of electronic components, then functionality and speed are improved, but alignment precision of vertical connections becomes more difficult to achieve
Solution Approach 1:
The patent applies preliminary action by obtaining images of conductive connectors and deriving overlay images before the bonding process. This allows alignment evaluation to be performed in advance, enabling adjustment or replacement of misaligned connectors before they are permanently bonded, thus resolving the alignment precision challenge while maintaining 3DIC productivity benefits
Solution Approach 2:
The patent introduces overlay images as an intermediary tool to evaluate alignment between conductive connectors on different semiconductor structures. This intermediary representation allows for non-destructive alignment assessment and adjustment before final bonding, addressing the precision requirement without compromising the integrated circuit functionality
2Reliability
If alignment evaluation is performed before bonding, then electrical transmission reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
The alignment evaluation system is self-service in that it automatically obtains images, derives overlay images, and evaluates alignment without requiring complex external intervention. The system identifies misaligned connectors and guides adjustments, simplifying the manufacturing process while ensuring electrical transmission reliability through pre-bonding verification
3Manufacturing precision
If misaligned connectors are adjusted or replaced before bonding, then bonding quality is improved, but manufacturing time and cost increase
Solution Approach 1:
The patent applies skipping by rapidly obtaining images and deriving overlay images in a streamlined process. This efficient image processing allows for quick identification of misaligned connectors, enabling prompt adjustment or replacement before bonding, thus improving bonding quality while minimizing the time added to the manufacturing process
Data Source
AI summary
The present disclosure provides a method for inspecting a semiconductor bonded structure. The method includes: obtaining a first image of a first connector of a first semiconductor structure; obtaining a second image of a second connector of a second semiconductor structure, wherein the second connector corresponds to the first connector; deriving an overlay image based on the first image and the second image; and evaluating an alignment of the first connector and the second connector based on the overlay image.