Bonded Embedded Capacitor Structure for Low-Impedance Power Delivery
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Solution Overview
Problem
There is a challenge in efficiently incorporating passive electronic components into electronic systems due to space constraints on integrated device dies, packages, and system boards, which affects signal integrity and performance.
Innovation Solution
A bonded structure is developed where a semiconductor element is directly bonded to a passive electronic component, such as a capacitor, without an intervening adhesive, allowing for a layered capacitor structure with high dielectric constant materials and optimized electrode configurations to reduce inductance and increase capacitance, thereby improving signal integrity and reducing space occupancy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive electronic components are incorporated using conventional discrete mounting methods, then ease of manufacture and assembly are improved, but space occupancy increases and signal integrity deteriorates
Solution Approach 1:
The patent merges the passive component fabrication process with the semiconductor element manufacturing process, integrating capacitor formation into the same fabrication sequence. This allows passive components to be created on the same substrate as active devices, eliminating separate mounting steps while reducing overall space requirements through shared processing infrastructure
Solution Approach 2:
The patent implements nesting by placing passive components within or adjacent to active device structures during fabrication. Capacitors are formed using the same interlayer dielectric layers and conductive structures that define active devices, effectively nesting passive functionality within the active device footprint and eliminating the need for separate discrete component mounting areas
2Device complexity
If passive electronic components are mounted on package substrate or system board, then device complexity is reduced, but signal integrity and bandwidth are worsened
Solution Approach 1:
The patent combines passive and active components into a single integrated device die structure, eliminating the need for separate package substrate and system board mounting locations. This integration maintains simplified device architecture while dramatically improving signal integrity by removing intermediate connection interfaces and reducing parasitic inductance associated with discrete mounting
3Manufacturing precision
If passive components are positioned away from active components, then manufacturing precision requirements are reduced, but inductance increases and signal integrity deteriorates
Solution Approach 1:
The patent nests passive components within the same fabrication process and physical structure as active devices, allowing precise co-location of passive and active elements during manufacturing. This integrated approach enables minimal spacing between components while maintaining manufacturing precision through shared process control, thereby minimizing parasitic inductance without requiring ultra-precise post-fabrication positioning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces system power delivery network impedance by over 1000 times compared to discrete capacitors, enhances bandwidth, and improves signal integrity by positioning passive components closer to active components, while minimizing space and material usage.
Implementation Method 1
a bonding layer can be provided over a surface of the passive electronic component. The bonding layer can directly bond the passive electronic component to the semiconductor element without an adhesive
Data Source
AI summary
In various embodiments, a passive electronic component is disclosed. The passive electronic component can have a first surface and a second surface opposite the first surface. The passive electronic component can include a nonconductive material and a capacitor embedded within the nonconductive material. The capacitor can have a first electrode, a second electrode, and a dielectric material disposed between the first and second electrodes. The first electrode can comprise a first conductive layer and a plurality of conductive fibers extending from and electrically connected to the first conductive layer. A first conductive via can extend through the passive electronic component from the first surface to the second surface, with the first conductive via electrically connected to the first electrode.