Adhesively Bonded Filter Patterns for Low-Cost mmWave Filter Fabrication
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Solution Overview
Problem
Conventional methods for manufacturing terahertz, sub-terahertz, and mmWave filters are costly and hinder rapid development and mass production, limiting their industrial and consumer applications.
Innovation Solution
A filter manufacturing method that uses a substrate with an adhesive layer and a conductive layer, where the conductive layer has non-overlapping first and second covering parts, allowing for cost-effective production using common printing devices like home printers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional precision manufacturing equipment (microelectronics manufacturing equipment, high-precision prototyping machines, high-energy laser precision cutting machines) is used to manufacture filters, then manufacturing precision and filter quality are improved, but manufacturing cost and equipment investment are significantly increased
Solution Approach 1:
The patent uses a conductive layer that is transferred or deposited onto an adhesive layer pattern, creating a copy of the filter pattern without requiring direct precision cutting or engraving. This copying approach allows using lower-cost equipment while maintaining pattern accuracy through the adhesive transfer mechanism
Solution Approach 2:
The patent replaces high-energy laser precision cutting machines and microelectronics manufacturing equipment with a simpler deposition and adhesive bonding system. The conductive layer is applied and bonded using controlled adhesion rather than mechanical cutting or high-precision lithography, significantly reducing equipment cost
2Manufacturing precision
If high-energy laser engraving machines, micro-imprinting machines, and laser sintering metal equipment are used for filter manufacturing, then filter manufacturing precision is improved, but equipment price and production complexity are increased
Solution Approach 1:
The patent segments the filter manufacturing process into distinct functional layers: an adhesive layer that defines the pattern, a conductive layer that provides the electromagnetic filtering function, and a substrate. This segmentation allows each layer to be manufactured and applied separately using simple, low-cost equipment rather than requiring complex integrated manufacturing systems
Solution Approach 2:
The adhesive layer acts as a temporary, disposable pattern definition layer that is used during manufacturing and then serves its purpose. The conductive layer is applied over it and bonded, making the adhesive layer's precise pattern transfer function sufficient without requiring durable, expensive manufacturing equipment
3Reliability
If conventional filter manufacturing methods are used, then filter performance is maintained, but mass production capability and rapid development are hindered due to high costs
Solution Approach 1:
The patent creates a universal manufacturing approach that can produce different filter designs using the same simple process and equipment. The adhesive layer pattern can be easily modified to create different filter geometries, and the conductive layer deposition process remains the same, enabling rapid prototyping and mass production of various filter types
Solution Approach 2:
The patent changes the fundamental manufacturing parameters from precision cutting/engraving to adhesive bonding and layer deposition. This parameter change enables faster production cycles, as the adhesive and conductive layers can be applied continuously over large areas without the slow, sequential nature of laser cutting or precision machining
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the cost of filter manufacturing, enables mass production, and facilitates rapid development of filters for industrial and consumer applications by utilizing affordable printing equipment.
Implementation Method 1
an adhesive layer coupled to the substrate; and a conductive layer, coupled to the adhesive layer
Data Source
AI summary
A manufacturing method of a filter, including the following steps: defining an adhesive layer on a surface of a substrate according to a filter pattern; covering the surface of the substrate by a conductive layer, wherein the conductive layer comprises a first covering part and a second covering part, wherein the first covering part and the second covering part are non-overlapping. In an aspect, the first covering part of the conductive layer is attached to the adhesive layer according to the filter pattern and the second covering part is not attached to the adhesive layer. In an aspect, the second covering part of the conductive layer is attached to the surface of the substrate to form the filter pattern.