Bonded Formed Laminates With 3D Deformations

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Solution Overview

Problem

Unformed, single layer substrates, such as nonwovens and films, lack resistance to bending, resilience to compression, and directional responses to tensile loads, relying heavily on polymer chemistry for aesthetics and structural properties, and are often thin and unappealing.

Innovation Solution

Laminates made from multiple layers of formed substrates with three-dimensional deformations, bonded at their distal ends, offering improved bending resistance, compression resilience, and directional tensile load responses, while maintaining softness and loft, and providing enhanced structural and aesthetic properties without relying on expensive polymers or additives.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If multiple layers of formed substrates are bonded together, then bending resistance and compression resilience are improved, but device complexity increases

Engineering Contradiction:
Improvebending resistanceVSAvoidlaminate structure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The substrate is divided into multiple layers, each with three-dimensional deformations that can be independently formed and bonded. This segmentation allows each layer to contribute specific mechanical properties, with the deformations providing bending resistance and compression resilience while the bonding layers together creates the overall structural integrity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces three-dimensional deformations (protrusions and recesses) into the substrate structure, moving from a two-dimensional flat configuration to a three-dimensional formed structure. This dimensional change enables the substrate to achieve enhanced mechanical properties such as bending resistance and compression resilience without requiring multiple separate components.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Stability of the object's composition

If multiple layers of formed substrates are bonded together, then compression resilience is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvecompression resilienceVSAvoidbonding process complexity
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

Multiple substrate layers with three-dimensional deformations are combined through bonding at the distal ends of the deformations. This merging approach allows the layers to work together to provide compression resilience, with the deformed regions serving as both structural elements and bonding interfaces, thereby reducing the need for separate bonding components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The three-dimensional deformations are formed on each substrate layer before the bonding process. By pre-forming the protrusions and recesses, the patent prepares the substrates with built-in alignment features and bonding surfaces, which simplifies the subsequent bonding process and ensures proper alignment of the layers.

Inventive Principle:
Principle #10Preliminary action

3Strength

If conventional thermal bonding is used, then substrate bonding is achieved, but softness and loft are lost

Engineering Contradiction:
Improvebonding strengthVSAvoidsoftness and loft
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The patent replaces conventional thermal bonding mechanisms with a mechanical bonding approach. Instead of using heat to bond the substrates, the three-dimensional deformations (protrusions and recesses) are mechanically interlocked through direct contact and bonding at the distal ends. This mechanical substitution preserves the softness and loft of the nonwoven material while achieving strong bonding.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Ease of manufacture

If unformed single layer substrates are used, then manufacturing simplicity is maintained, but structural properties and aesthetics are insufficient

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidstructural properties
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The patent transforms the substrate from an unformed state to a formed state by creating three-dimensional deformations through controlled stretching and bonding. This parameter change in the physical configuration of the substrate enables enhanced structural properties and aesthetic appearance while maintaining manufacturing feasibility through established nonwoven processing techniques.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The bonded formed laminates exhibit improved mechanical properties and aesthetics, maintaining softness and loft, and can be designed with thicker portions and patterns, offering functional benefits at a reasonable cost compared to unformed substrates.

Implementation Method 1

Nonwovens while supplying clothlike feel, loft and softness suffer from losing that softness and loft when processed into a laminate by conventional methods such as simple thermal bonding.

Methodology Applied
Scientific EffectThermal bonding:

Data Source

PatentUS11833805B2Bonded laminate including a formed nonwoven substrate
Publication Date: 2023.12.05 PROCTER & GAMBLE CO
  • US11833805B2 patent drawing
  • US11833805B2 patent drawing
  • US11833805B2 patent drawing

AI summary

Bonded formed laminates, and methods for making bonded formed laminates, are made from multiple layers of formed substrates comprising at least one nonwoven formed substrate which are bonded together at the distal ends or bases of protrusions formed in the substrates. The bonded formed laminate provides a very soft and lofty structure that is sustainable under compression.