Bonded Glass Substrate Structure Without Conductive Paste
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Solution Overview
Problem
Current methods for fabricating through glass vias (TGVs) in glass substrates face electrical discontinuity issues due to resistance variations in conductive paste, affecting the electrical reliability of the substrate structure.
Innovation Solution
A substrate structure is designed with aligned conductive pads and electroless metal layers on dielectric substrates, bonded via non-metallic and metal interfaces, eliminating the need for conductive paste and high-thickness glass, ensuring electrical continuity and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive paste is used to electrically connect TGVs in joined glass substrates, then electrical connection is achieved, but electrical discontinuity and resistance variations occur affecting reliability
Solution Approach 1:
The patent removes the conductive paste from the connection structure between TGVs. Instead of using conductive paste in the resin material, the invention directly bonds glass substrates with TGVs through the resin, eliminating the intermediate conductive paste layer that causes electrical discontinuity and resistance variations.
Solution Approach 2:
The patent employs a composite bonding structure where the resin material serves both as an adhesive for joining glass substrates and as a structural medium for embedding TGVs. This integrated approach replaces the traditional separate conductive paste layer, achieving both mechanical bonding and electrical connection through the composite resin-TGV-glass structure.
2Ease of manufacture
If additional resin material and conductive paste are used for bonding and electrical connection, then substrate joining is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The resin material performs multiple functions simultaneously: it acts as an adhesive for bonding glass substrates, provides structural support for embedding TGVs, and serves as the medium for achieving electrical connections. This multi-functionality eliminates the need for separate conductive paste and additional bonding materials, reducing overall material quantity.
Solution Approach 2:
The patent merges the bonding function and electrical connection function into a single integrated structure. The resin material and TGVs work together to achieve both mechanical substrate joining and electrical connectivity, eliminating the need for separate conductive paste layers and reducing the total quantity of materials required.
3Strength
If high-thickness glass substrates are used to maintain structural integrity, then mechanical strength is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent changes the structural parameters of the substrate assembly by using thinner glass substrates compensated by the resin-TGV bonding structure. The resin material and TGV configuration provide the necessary mechanical support and structural integrity, allowing the use of thinner glass substrates without compromising overall strength.
Solution Approach 2:
The patent creates a composite structure where the resin material and TGVs work together with the glass substrates to provide structural integrity. This composite approach allows the use of thinner glass substrates because the resin-TGV system compensates for the reduced glass thickness, maintaining overall mechanical strength while reducing substrate thickness complexity.
Data Source
AI summary
A substrate structure includes a first substrate and a second substrate. The first substrate includes a first dielectric substrate, at least one first conductive via, at least one first conductive pad, a first bonding layer, and a first electroless metal layer. The second substrate includes a second dielectric substrate, at least one second conductive via, at least one second conductive pad a second bonding layer, and a second electroless metal layer. The second substrate is bonded to the first substrate, wherein the second bonding layer is bonded to the first bonding layer to define a non-metallic contact interface, and the second electroless metal layer is bonded to the first electroless metal layer to define a metal bonding contact interface.