Thermally Bonded Heat Pipe Plate for Flight Thermal Management
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Solution Overview
Problem
Conventional thermal regulation systems for flight applications are heavy, space-intensive, and inefficient in transferring heat away from thermal sources, particularly in enclosed or vacuum environments, making them costly and complex to retrofit for increased thermal loads.
Innovation Solution
A heat exchanger system featuring a conductive metal heat exchanger plate with thermally bonded heat pipes and a thermal interface material, which efficiently transfers heat from thermal sources to a thermal sink, minimizing space and weight while enhancing thermal transfer capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional thermal regulation systems are used, then heat transfer capacity is achieved, but weight and space requirements increase significantly
Solution Approach 1:
The patent combines multiple heat pipes into a single integrated heat exchanger plate assembly, merging previously separate components into one unified structure that achieves superior heat transfer capacity while reducing overall system weight and space requirements
Solution Approach 2:
The heat exchanger plate utilizes composite construction with thermally conductive materials bonded to form channels and heat pipe integrations, creating a multi-material structure that optimizes both thermal performance and weight characteristics
2Productivity
If conventional thermal regulation systems are used, then heat transfer capacity is achieved, but system complexity and manufacturing cost increase
Solution Approach 1:
The patent integrates multiple heat pipes and channels into a single molded heat exchanger plate, combining previously separate components into one piece that simplifies assembly and reduces manufacturing complexity while maintaining high heat transfer capacity
Solution Approach 2:
The heat exchanger plate serves multiple functions simultaneously: it acts as a structural mounting plate, provides thermal conduction pathways, houses integrated heat pipes, and offers mounting surfaces for thermal sources and sinks, thereby reducing the number of separate components needed
3Productivity
If heat pipes are thermally bonded to both sides of channels, then heat transfer efficiency increases by 50%, but manufacturing precision requirements increase
Solution Approach 1:
The heat pipes are pre-positioned within channels and thermally bonded to both sides of channel walls before final assembly, establishing precise thermal contact interfaces in advance that ensure optimal heat transfer efficiency while simplifying the overall manufacturing process
Solution Approach 2:
The channel walls act as intermediary structures that provide standardized surfaces for thermal bonding, mediating between the heat pipes and the external environment while ensuring consistent thermal contact and reducing manufacturing precision requirements through standardized interface geometry
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides a significant improvement in heat transfer efficiency, approximately 50% more effective than conventional systems, by thermally bonding heat pipes to both sides of channels in the heat exchanger plate, allowing for efficient heat dissipation in space-constrained and weight-sensitive flight applications.
Implementation Method 1
heat pipes coupled to and/or within the heat exchanger plate
Implementation Method 2
conductive metal heat exchanger plate
Implementation Method 3
thermal interface material may be positioned within the recess, and a thermal sink may be secured to the heat exchanger plate at the recess to provide compression contact with the thermal interface and thermal coupling
Implementation Method 4
thermal sink may be further physically secured to a radiator to express heat into the environment
Implementation Method 5
radiate the heat into the environment (e.g., a surrounding gas, fluid, vacuum, and/or other environment)
Data Source
AI summary
An apparatus and method according to one or more embodiments are provided to transfer heat away from various types of thermal sources in flight and/or non-flight systems. Heat transfer may be implemented as a heat exchanger plate that effectively transports heat from a physically secured thermal source to a thermal sink and further to a radiator. In one example, a heat exchanger plate includes a channel extending longitudinally along a surface of the heat exchanger plate and a heat pipe coupled substantially within the channel. A bottom surface and a lateral surface of the heat pipe are thermally bonded to a bottom surface and a lateral surface of the channel, respectively. Additional apparatus and methods are provided.