Bonded Hinge Structure for Information Handling Systems

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Solution Overview

Problem

Previous information handling systems experience reduced airflow and increased skin temperatures due to hinge assemblies blocking exhaust ports, which impede heat dissipation.

Innovation Solution

A bonded hinge assembly with a support frame and integrated hinge, where the hinge is bonded to the support frame using metal bonding techniques, reducing hot air impedance and enhancing thermal performance by allowing greater airflow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a traditional hinge assembly is used, then the hinge provides mechanical support and movement, but the hinge blocks exhaust ports and reduces airflow

Engineering Contradiction:

Improvemechanical supportVSAvoidairflow

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The hinge assembly is segmented into distinct functional zones: the support frame provides structural support while the hinge mechanism is positioned to avoid blocking exhaust ports. This segmentation allows the support frame to maintain mechanical reliability while the exhaust ports remain unobstructed for optimal airflow.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The hinge is repositioned from a configuration that blocked the exhaust port opening to a configuration where it is integrated within the support frame structure, effectively moving the hinge to another spatial dimension that does not interfere with the exhaust port while maintaining its mechanical function.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of operation

If a traditional hinge assembly is used, then the hinge provides rotation and movement, but skin temperatures increase due to impeded heat dissipation

Engineering Contradiction:

ImproverotationVSAvoidskin temperature

Core Design Contradiction:

Ease of operationVSTemperature

Solution Approach 1:

By segmenting the hinge assembly into a support frame and a separately positioned hinge mechanism, the design allows heat to dissipate through the exhaust ports without being blocked by the hinge, thereby reducing skin temperatures while preserving rotational movement capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The design converts the potential harm of the hinge blocking the exhaust port into a benefit by integrating the hinge within the support frame structure, allowing the hinge to provide rotation while the open exhaust ports enable improved heat dissipation and lower skin temperatures.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Productivity

If the hinge is integrated within the support frame, then airflow impedance is reduced, but manufacturing complexity increases due to bonding requirements

Engineering Contradiction:

ImproveairflowVSAvoidmanufacturing process

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The hinge is integrated within the support frame through bonding, merging two components into a unified assembly. This integration eliminates the need for separate mounting hardware and simplifies the overall structure, reducing airflow impedance while the bonding process, though added, streamlines manufacturing by creating a permanent, rigid connection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Traditional mechanical fastening methods (screws, clips, or interlocking mechanisms) are replaced with bonding technology to integrate the hinge within the support frame. This substitution eliminates complex mechanical assembly steps and creates a more streamlined structure that reduces airflow impedance.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Temperature

If the hinge is integrated within the support frame, then thermal performance is enhanced, but structural complexity increases

Engineering Contradiction:

Improvethermal performanceVSAvoidstructural complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The hinge and support frame are merged into a single integrated assembly through bonding, creating a unified structure that enhances thermal performance by eliminating gaps and improving heat transfer pathways, while the integrated design actually reduces overall structural complexity compared to separate components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The bonding process creates a composite structure where the hinge and support frame materials are joined to form an integrated assembly. This composite construction enhances thermal performance by providing continuous thermal pathways and eliminates thermal breaks that would exist between separate components, while the bonding interface adds minimal structural complexity.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS12079046B2Bonded hinge structure for an information handling system

Publication Date: 2024.09.03 DELL PROD LP

AI summary

An information handling system includes a cover and a bonded hinge assembly bonded to the cover. The bonded hinge assembly includes a support frame and a hinge. The support frame has a low airflow impedance. The hinge is bonded to the support frame. The hinge is integrated within the support frame when the hinge is bonded to the support frame.