Redundant Bonded Interconnect Circuitry for Void-Tolerant Signal Routing
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Solution Overview
Problem
Existing bonded semiconductor structures face issues with voids and debris at the bond interface between contact pads, leading to faulty interconnects and potential failure of electrical connections, particularly in high-frequency applications.
Innovation Solution
Implementing redundant electrical connections and switching circuitry that reroutes signals through alternate paths using multiplexers, demultiplexers, and tri-state drivers to ensure continuity even if primary connections fail, with active circuitry to maintain high-frequency operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If direct bonding of contact pads is used to achieve electrical connections, then manufacturing simplicity is improved, but reliability deteriorates due to voids and debris at the bond interface
Solution Approach 1:
The bonding interface is segmented into multiple regions: primary contact pads for electrical connection and separate redundant contact pads for backup connections. This segmentation allows the system to tolerate defects in specific regions while maintaining overall functionality through alternative pathways.
Solution Approach 2:
Redundant contact pads and bonding interfaces are prepared in advance before any failure occurs. These backup elements remain dormant during normal operation but automatically become active if voids or debris cause failures in the primary bonding interface, providing beforehand protection against reliability issues.
2Reliability
If redundant electrical connections are implemented, then reliability is improved, but device complexity increases due to additional circuitry
Solution Approach 1:
The bonding structure provides self-service through automatic failover functionality. When voids or debris cause failures in primary contact pads, the redundant contact pads automatically assume the electrical connection function without requiring external intervention, complex control systems, or additional management circuitry.
Solution Approach 2:
The redundant contact pads are merged with the primary bonding structure in a unified interface design. Both primary and redundant contact pads share the same bonding layer and physical structure, eliminating the need for separate redundant bonding interfaces and reducing overall device complexity despite the added redundancy functionality.
3Area of stationary object
If contact pads are spaced closely for high-density integration, then area efficiency is improved, but manufacturing precision requirements increase due to difficulty in avoiding voids and debris
Solution Approach 1:
The bonding interface is segmented into primary and redundant contact pad regions, allowing close spacing of functional pads while providing separate backup regions. This segmentation enables high-density integration of active elements while dedicating specific areas for redundancy without increasing overall area significantly.
Solution Approach 2:
The design changes the spatial distribution parameters of contact pads by introducing redundant elements at specific locations and orientations. These parameter changes create geometric redundancy that tolerates manufacturing variations and defects, allowing close spacing while maintaining reliability without requiring excessive manufacturing precision.
Data Source
AI summary
A bonded structure is disclosed. The bonded structure can include a first element that has a first plurality of contact pads. The first plurality of contact pads includes a first contact pad and a second redundant contact pad. The bonded structure can also include a second element directly bonded to the first element without an intervening adhesive. The second element has a second plurality of contact pads. The second plurality of contact pads includes a third contact pad and a fourth redundant contact pad. The first contact pad is configured to connect to the third contact pad. The second contact pad is configured to connect to the fourth contact pad. The bonded structure can include circuitry that has a first state in which an electrical signal is transferred to the first contact pad and a second state in which the electrical signal is transferred to the second contact pad.