Bonded Multi-Die Layout With Dummy Edge Patterns for Stability
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving high structural stability and reliability, particularly during the fabrication process, which can lead to failures and affect electrical characteristics and driving stability.
Innovation Solution
The implementation of a semiconductor device design that includes a substrate with a lower die and an upper die bonded together, featuring a guard ring structure and dummy patterns on the edge region to enhance structural stability and prevent deformation, along with a hybrid bonding structure using protection layers for improved electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor chips are vertically stacked to achieve high-density integration, then the device capacity and integration density are improved, but the structural stability and reliability during fabrication deteriorate
Solution Approach 1:
The patent applies preliminary action by forming guard ring structures and dummy patterns around the semiconductor elements before the actual bonding process. These structures are pre-configured to prevent deformation and maintain structural stability during subsequent fabrication steps, thereby resolving the contradiction between high-density stacking and structural reliability.
Solution Approach 2:
The guard ring structures and dummy patterns serve as beforehand cushioning elements that absorb and distribute mechanical stress during the bonding process. These pre-positioned structures prevent deformation of the semiconductor elements, ensuring structural stability while maintaining the high-density vertical stacking configuration.
2Reliability
If bonding structures are used to connect semiconductor chips, then the electrical connectivity is improved, but the deformation and fabrication failures increase
Solution Approach 1:
The patent introduces guard ring structures and dummy patterns as intermediary elements between the bonding structures and the semiconductor elements. These intermediaries absorb mechanical stress and prevent direct transmission of deformation forces to the bonding structures, thereby maintaining both electrical connectivity and preventing deformation during fabrication.
3Ease of manufacture
If the semiconductor device structure is simplified for easier manufacturing, then the ease of manufacture is improved, but the structural stability and electrical characteristics deteriorate
Solution Approach 1:
The patent applies local quality by strategically placing guard ring structures and dummy patterns only in critical regions where deformation prevention is needed, rather than uniformly across the entire device. This localized approach maintains structural stability and electrical characteristics while minimizing the complexity added to the manufacturing process.
Data Source
AI summary
A semiconductor device includes a substrate and a lower die on the substrate. The lower die includes a first semiconductor substrate having a first device region and a first edge region therein, a first semiconductor element on the first device region, a first pad on the first device region and on the first semiconductor element, and a first interconnection structure connecting the first semiconductor element to the first pad. The first interconnection structure includes a first signal pattern on the first device region and connected to the first semiconductor element, a second signal pattern on the first device region and directly connected to the first pad, and a first dummy pattern at the same level as the second signal pattern and disposed on the first edge region. An upper die is provided, which is bonded to the lower die such that the first pad of the lower die is in contact with a second pad of the upper die.