Bonded OFDM System Throughput via Parallel Signal Pathways

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Solution Overview

Problem

Conventional OFDMA-based communication systems experience bottlenecks in data throughput due to limitations in physical (PHY)/media access controller (MAC) interaction at coaxial cable interfaces, particularly in Multimedia over Coax Alliance (MoCA)-based systems.

Innovation Solution

The implementation of a bonded OFDM communication system that uses multiple signal pathways bonded together to form a high-throughput physical channel, with RF modulation at frequencies higher than standard MoCA-specified frequencies, and incorporates adaptive predicted slotted timing mechanisms within the TDMA protocol to enhance bandwidth utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional OFDMA-based signaling is used at coaxial cable interfaces, then system compatibility and standard adherence are maintained, but data throughput is limited due to PHY/MAC interaction bottlenecks

Engineering Contradiction:
Improvedata throughputVSAvoidPHY/MAC interaction complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the data transmission by dividing the data stream into multiple parallel sub-channels, each carrying a portion of the data. This segmentation allows simultaneous transmission over multiple frequency bands, effectively bypassing the PHY/MAC interaction bottleneck and achieving higher aggregate throughput while maintaining compatibility with existing OFDMA standards.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an additional spatial dimension by bonding multiple physical interfaces (e.g., multiple coaxial cable connections) to create a multi-dimensional transmission path. This bonded interface approach transforms a single-dimensional throughput limitation into a multi-dimensional parallel transmission system, achieving throughput scaling without increasing per-interface complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If multiple signal pathways are bonded together to increase throughput, then data rate improves, but system complexity and interface requirements increase

Engineering Contradiction:
Improvedata throughputVSAvoidbonded interface complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent merges multiple signal pathways at the physical layer to form a bonded interface that appears as a single logical high-speed connection to upper layers. This merging approach consolidates the complexity of managing multiple interfaces into a unified bonding mechanism, achieving high throughput while presenting a simplified interface to the network stack.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The bonded interface design provides multi-functionality by enabling both high-speed bonded transmission and fallback to individual interface operation. The system can dynamically adapt between bonded and non-bonded modes, providing universal compatibility with different network configurations and maintaining backward compatibility while enabling advanced high-throughput operation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS9634874B2Bonded OFDM communication system
Publication Date: 2017.04.25 VIXS SYSTEMS INC
  • US9634874B2 patent drawing
  • US9634874B2 patent drawing
  • US9634874B2 patent drawing

AI summary

An orthogonal frequency division multiplexing (OFDM) communication system includes a first interface having a first cable coupler to couple to a first end of a coaxial cable, and a first plurality of signal pathways coupled to the first cable coupler. Each signal pathway of the first plurality includes a physical (PHY) layer component and a radio frequency (RF) front end coupled to the PHY layer component. The system further includes a second interface having a second cable coupler to couple to a second end of a coaxial cable, and a second plurality of signal pathways coupled to the second cable coupler. Each signal pathway of the second plurality corresponds to a signal pathway of the first plurality and includes a PHY layer component and an RF front end coupled to the PHY layer component.