Bonded Optical Elements for Fine-Pitch Full-Color Microdisplays
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Solution Overview
Problem
Existing display technologies, such as liquid crystal-on-silicon and micro light emitting diodes, face challenges in providing high-resolution, high-brightness images for wearable devices like AR smart glasses due to inefficient optical energy use, low manufacturing yield, and difficulties in creating multi-colored displays.
Innovation Solution
Direct bonding of monochromatic LED chips to a carrier, such as a silicon-based processor, without an adhesive, using dielectric-to-dielectric bonding techniques, to achieve pixel pitches as small as 5 microns, enabling multi-colored displays through superposition of monochromatic images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LCoS technology is used to achieve low pixel pitch, then pixel pitch can be reduced, but optical energy efficiency deteriorates and manufacturing yield decreases
Solution Approach 1:
The invention segments the display into multiple monochromatic sub-displays (red, green, blue) that are bonded together. Each sub-display is optimized for its specific wavelength, eliminating the optical energy losses inherent in LCoS technology while achieving fine pixel pitches through the bonding integration of multiple higher-resolution monochromatic components.
2Manufacturing precision
If LCoS technology is used to achieve low pixel pitch, then pixel pitch can be reduced, but manufacturing yield deteriorates
Solution Approach 1:
By dividing the display into separate monochromatic sub-displays that can be manufactured and tested independently, the invention improves manufacturing yield. Each monochromatic sub-display can be optimized and quality-checked separately before bonding, reducing the risk of defects affecting the entire display while achieving fine pixel pitch through integration.
3Loss of energy
If microLED technology is used to provide high brightness, then optical energy efficiency improves, but creating multi-colored displays deteriorates
Solution Approach 1:
The invention merges multiple monochromatic microLED sub-displays (red, green, blue) into a single integrated display through direct bonding. Each sub-display maintains its high optical energy efficiency and brightness characteristics while the combination of multiple sub-displays provides full-color capability, resolving the contradiction between efficiency and color versatility.
4Ease of manufacture
If adhesive bonding is used to attach optical elements, then ease of manufacture improves, but optical energy transmission deteriorates
Solution Approach 1:
The invention extracts and eliminates the adhesive layer from the bonding process, using direct dielectric-to-dielectric bonding instead. This removal of the adhesive intermediary prevents optical energy transmission losses while maintaining ease of manufacture through standardized semiconductor bonding processes that are well-established in the industry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances manufacturability and image quality by allowing fine pixel pitches and efficient energy use, resulting in high-resolution, multi-colored images for wearable devices.
Implementation Method 1
bonded without an adhesive, wherein the dielectric bonding surfaces are directly bonded to one another without an adhesive
Data Source
AI summary
A bonded optical device is disclosed. The bonded optical device can include a first optical element, a second optical element, and an optical pathway. The first optical element has a first array of optical emitters configured to emit light of a first color. The first optical element is bonded to at least one processor element, the at least one processor element including active circuitry configured to control operation of the first optical element. The second optical element has a second array of optical emitters configured to emit light of a second color different from the first color. The second optical element is bonded to the at least one processor element. The optical pathway is optically coupled with the first and second optical elements. The optical pathway is configured to transmit a superposition of light from the first and second optical emitters to an optical output to be viewed by users.