Bonded Optical Sensing Device for High-Resolution, Lower-Cost Detection
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Solution Overview
Problem
The increasing size and manufacturing cost of optical sensing devices due to improved resolution pose challenges for widespread use, necessitating a structural design that reduces costs while maintaining sensing sensitivity.
Innovation Solution
A sensing device with a driving substrate and sensing module bonded through electrodes, utilizing epitaxial substrates and specific electrode widths, pitch, and light wavelengths to enhance electrical connection and reduce noise, thereby improving signal-to-noise ratio and overall performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the resolution of the optical sensing device is improved, then the sensing precision is improved, but the size of the sensor chip increases and the manufacturing cost increases significantly
Solution Approach 1:
The patent divides the sensor chip into multiple independent sensing elements arranged in an array, where each sensing element can be independently controlled and read out. This segmentation allows the system to achieve high resolution through multiple discrete detection points while maintaining manageable individual element sizes and simplifying the overall manufacturing process.
Solution Approach 2:
The patent optimizes key parameters including the pitch between sensing elements (15-20 μm), electrode dimensions (bonding pad width ≥ first electrode width ≥ second electrode width), and light wavelength (4-10 μm) to achieve an optimal balance between resolution and manufacturing complexity. These parameter optimizations enable high sensing precision without proportionally increasing chip size or manufacturing difficulty.
2Measurement precision
If the resolution of the optical sensing device is improved, then the sensing precision is improved, but the manufacturing cost increases significantly
Solution Approach 1:
The patent specifies optimized parameter ranges including sensing element pitch (15-20 μm), electrode width ratios (bonding pad: first electrode: second electrode ≥ 1:1:1), and operating wavelength (4-10 μm) that balance manufacturing cost with sensing precision. These parameter optimizations enable high resolution at reduced manufacturing cost by avoiding excessive dimensions and complex structures.
Solution Approach 2:
The patent employs composite substrate structures combining first substrate material (glass or polyimide) with second substrate material (epitaxial substrate) to achieve both mechanical stability and optical transparency in the infrared range. This composite approach reduces manufacturing cost while maintaining the required optical properties for high-resolution sensing.
3Measurement precision
If the pitch between sensing elements is reduced to increase resolution, then the sensing precision is improved, but the electrical connection complexity increases
Solution Approach 1:
The patent optimizes the pitch between sensing elements to a specific range (15-20 μm) that provides sufficient resolution while maintaining feasible electrode dimensions and connection complexity. The electrode width constraints (bonding pad width ≥ first electrode width ≥ second electrode width) are also optimized to ensure reliable electrical connections without excessive complexity as pitch is reduced.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design reduces manufacturing costs and enhances sensitivity by optimizing substrate materials and structural configurations, improving signal-to-noise ratio and overall performance of optical sensing devices.
Implementation Method 1
The sensing element in the optical sensing device can convert received light into an electrical signal
Implementation Method 2
The wavelength of light penetrating the first substrate is greater than or equal to 4 μm and less than or equal to 10 μm
Data Source
AI summary
A sensing device is provided. The sensing device includes a driving substrate, a sensing module, and a plurality of bonding pads. The driving substrate includes a first substrate and a plurality of driving circuits disposed on the first substrate. Each of the driving circuits includes a plurality of thin-film transistors. The sensing module is bonded to the driving substrate, and the sensing module includes a second substrate and a plurality of sensing elements disposed on the second substrate. The sensing module is bonded to the driving substrate through the bonding pads. In addition, each of the driving circuits is electrically connected to at least one of the sensing elements. The wavelength of light penetrating the first substrate is greater than or equal to 4 μm and less than or equal to 10 μm. An electronic device including the sensing device is also provided.