Direct Bonded Passive Components Reduce Inductance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a challenge in efficiently incorporating passive electronic components into electronic systems due to space constraints on integrated device dies, packages, and system boards, which affects signal integrity and bandwidth.
Innovation Solution
A bonded structure is created by directly bonding a semiconductor element with a passive electronic component, such as a capacitor, without an intervening adhesive, using high dielectric constant materials and direct bonding techniques to reduce inductance and increase capacitance, thereby improving signal integrity and reducing space occupancy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive electronic components are mounted on package substrate or system board, then ease of manufacture is improved, but space occupancy increases and inductance increases
Solution Approach 1:
The patent merges the passive component with the semiconductor element by directly bonding the passive component to the active surface of the semiconductor element, eliminating the need for separate mounting on package substrate or system board. This integration reduces space occupancy while maintaining ease of manufacture through direct bonding processes.
Solution Approach 2:
The patent transitions from planar mounting on package substrate to vertical integration by bonding the passive component directly to the active surface of the semiconductor element. This dimensional change from 2D package mounting to 3D direct integration reduces overall space occupancy and interconnect length.
2Ease of manufacture
If passive electronic components are mounted on package substrate, then ease of manufacture is improved, but inductance increases and signal integrity deteriorates
Solution Approach 1:
By merging the passive component directly with the semiconductor element through direct bonding, the patent eliminates long interconnect paths that generate inductance. The passive component is positioned immediately adjacent to the active circuitry, minimizing loop area and reducing harmful inductive effects.
3Volume of moving object
If passive electronic components are mounted on die, then space occupancy is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by preparing bonding surfaces and applying bonding pressure before final integration. The bonding process is initiated while components are still accessible, allowing for controlled integration that reduces overall device complexity compared to post-assembly mounting approaches.
4Ease of manufacture
If adhesive is used to bond passive component, then ease of manufacture is improved, but bonding strength is reduced
Solution Approach 1:
The patent extracts the adhesive layer from the bonding process, achieving direct bonding between the passive component and semiconductor element. This elimination of the adhesive intermediary strengthens the bond while maintaining ease of manufacture through direct contact bonding techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces impedance and increases capacitance, enhancing signal integrity and bandwidth by integrating passive components closer to active components, outperforming discrete passives mounted on dies or substrates.
Implementation Method 1
using high dielectric constant materials to reduce inductance and increase capacitance
Implementation Method 2
directly bonding a semiconductor element with a passive electronic component, such as a capacitor, without an intervening adhesive
Data Source
AI summary
In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component directly bonded to the element without an intervening adhesive. The passive electronic component can comprise a capacitive sheet with a lateral width of at least three times its width. In some embodiments, the passive electronic component can comprise a plurality of dielectric layers disposed between three or more conductive layers. In some embodiments, the passive electronic component can comprise a thin film, high dielectric constant material disposed between two refractory metals.