Bonded Passive Component Structure for Low-Inductance Packaging
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Solution Overview
Problem
Incorporating passive electronic components such as capacitors, resistors, and inductors into electronic systems is challenging due to space constraints on integrated device dies, packages, and system boards, which affects performance and efficiency.
Innovation Solution
Directly bonding passive electronic components, such as capacitors, to semiconductor elements without intervening adhesives, utilizing high dielectric constant materials and layered capacitor structures to reduce space occupation and improve signal integrity and bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive electronic components are incorporated using conventional mounting methods, then they can be easily manufactured and assembled, but they occupy valuable space on integrated device dies, packages, and system boards
Solution Approach 1:
The patent merges the passive electronic component with the integrated device die by directly bonding the component to the die surface, eliminating the need for separate mounting structures and reducing overall space occupation while maintaining manufacturability
Solution Approach 2:
The patent transitions from planar mounting to three-dimensional integration by stacking the passive component vertically above the active device area, utilizing the vertical dimension to reduce footprint on the system board
2Ease of manufacture
If passive electronic components are positioned farther from active components, then manufacturing and assembly are simplified, but signal integrity and bandwidth are degraded due to increased inductance
Solution Approach 1:
By merging the passive component directly onto the die surface, the patent minimizes the distance between active and passive components, reducing parasitic inductance and improving signal integrity while maintaining manufacturing simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces overall inductance and increases capacitance, enhancing signal integrity and bandwidth by positioning passive components closer to active components, while reducing the overall dimensions of the package and system board.
Implementation Method 1
utilizing high dielectric constant materials to reduce space occupation and improve signal integrity and bandwidth
Implementation Method 2
Directly bonding passive electronic components, such as capacitors, to semiconductor elements without intervening adhesives
Data Source
AI summary
In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.