Bonded Protective Elements for Tamper-Resistant Semiconductor Circuits

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Solution Overview

Problem

Existing semiconductor chips face challenges in protecting security-sensitive components from unauthorized access and reverse engineering by third parties, as conventional materials and methods are either incompatible with semiconductor processing or ineffective against various hacking techniques.

Innovation Solution

The integration of a protective element, comprising abrasive, light-blocking, or destructive materials, directly bonded to the semiconductor element, which physically damages or obstructs access to sensitive circuitry, and includes disruption structures to disrupt functionality upon removal, using dielectric-to-dielectric bonding techniques to enhance security.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional protective materials are used, then ease of manufacture is maintained, but security effectiveness deteriorates as they are ineffective against hacking techniques

Engineering Contradiction:

Improvesecurity effectivenessVSAvoidcompatibility with semiconductor processing

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the material parameters by using dielectric materials with specific properties (etch selectivity, bonding characteristics) that are compatible with semiconductor processing while providing enhanced security. The bonding strength and etch resistance parameters are optimized to prevent unauthorized removal while maintaining manufacturability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The protective element uses composite structures combining multiple dielectric layers with different etch selectivities and mechanical properties. This composite approach provides both security effectiveness (resistance to hacking) and compatibility with existing semiconductor manufacturing processes

Inventive Principle:

Principle #40Composite materials

2Reliability

If abrasive or destructive materials are used to physically damage tools, then security effectiveness improves, but device complexity increases

Engineering Contradiction:

Improvesecurity effectivenessVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The abrasive or destructive materials are applied locally only in specific regions where security protection is most needed, rather than throughout the entire device. This localized application provides security effectiveness while minimizing the increase in overall device complexity

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The protective elements with abrasive or destructive properties are pre-configured into the semiconductor structure during manufacturing, before any potential hacking attempts. This preliminary integration ensures security is built-in without requiring complex post-manufacturing assembly

Inventive Principle:

Principle #10Preliminary action

3Reliability

If disruption structures are added to disrupt functionality upon removal, then security effectiveness improves, but ease of operation deteriorates

Engineering Contradiction:

Improvesecurity effectivenessVSAvoidoperational convenience

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The disruption structures are designed to convert the harmful act of unauthorized removal into a beneficial security outcome. When someone attempts to remove the protective element, the disruption structures automatically activate to damage or destroy the underlying circuitry, thereby protecting the intellectual property. The harm (removal attempt) is transformed into a security benefit (circuitry destruction)

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The disruption structures are pre-configured to provide automatic anti-action against removal attempts. Before any hacking can occur, the structures are already in place to counteract removal efforts by destroying the circuitry, eliminating the need for active monitoring or user intervention

Inventive Principle:

Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents unauthorized access and reverse engineering by physically damaging tools or circuitry, while maintaining compatibility with semiconductor processing, thus enhancing the security of sensitive components.

Implementation Method 1

The protective element includes an abrasive material configured to physically damage tools or circuitry that attempt to access the active circuitry

Methodology Applied

Scientific EffectAbrasion: Abrasion

Implementation Method 2

a bonding layer directly bonding the protective element to the semiconductor element without an adhesive

Methodology Applied

Scientific EffectDielectric bonding:

Data Source

PatentUS12451445B2Protective elements for bonded structures

Publication Date: 2025.10.21 ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

AI summary

A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over at least a portion of the active circuitry. The obstructive material can be configured to obstruct external access to the active circuitry. The bonded structure can include a disruption structure configured to disrupt functionality of the at least a portion of the active circuitry upon debonding of the protective element from the semiconductor element.