Bonded Semiconductor Structure With Flat Insulator Edge Support
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Solution Overview
Problem
The challenge in manufacturing semiconductor devices lies in effectively processing bonded bodies of substrates to avoid mechanical damage and void formation due to unbonded areas, which can lead to chipping and difficulty in subsequent processing steps.
Innovation Solution
Incorporating an insulating member with a flat portion between the bonded substrates to support and stabilize the device structures, and embedding this member into a groove formed by removing unbonded areas to facilitate smooth polishing and heat treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If bonding is performed between two substrates to form a bonded body, then device integration is achieved, but unbonded areas cause mechanical damage and void formation during processing
Solution Approach 1:
The patent applies preliminary action by removing unbonded areas before subsequent processing steps. The method involves detecting unbonded areas in the bonded body and selectively removing them prior to polishing or heat treatment, preventing mechanical damage and void formation that would occur during these processes. This proactive removal eliminates the root cause of reliability issues before they manifest during manufacturing.
Solution Approach 2:
The patent extracts the harmful unbonded areas from the bonded body through selective removal. By identifying and removing only the unbonded portions while preserving the properly bonded regions, the method eliminates the source of mechanical damage and void formation. This extraction approach maintains the integrity of the bonded structure while removing缺陷 that would compromise reliability.
2Productivity
If unbonded areas are left in the bonded body, then processing steps can be performed, but chipping occurs and subsequent processing becomes difficult
Solution Approach 1:
The patent performs preliminary removal of unbonded areas before polishing or heat treatment steps. By detecting and removing unbonded regions in advance, the method prevents chipping during subsequent processing and eliminates the difficulty of handling defective bonded bodies. This preliminary action ensures that all subsequent processing steps can be performed on intact, high-quality bonded structures.
3Reliability
If insulating member with flat portion is incorporated to support device structures, then stability and integrity are enhanced, but device complexity increases
Solution Approach 1:
The patent introduces an insulating member with a flat portion as an intermediary element between the bonded substrates. This insulating member serves as a support structure that enhances the stability and integrity of the bonded body during processing. The flat portion of the insulating member provides a stable surface that prevents mechanical damage and ensures proper alignment, acting as a mediator that protects the device structures without requiring complex modifications to the bonding process itself.
Data Source
AI summary
According to one embodiment, there is provided a semiconductor device including a first device structure, a second device structure and an insulating member. The first device structure has a first flat surface. The second device structure has a second flat surface bonded to the first flat surface. The insulating member is arranged between an outer end of the first device structure and an outer end of the second device structure, the insulating member including a flat portion, the flat portion internally including an extension plane of the first flat surface and the second flat surface, the flat portion extending flat along the extension plane.