Bonded Protective Semiconductor Layers Against Optical and FIB Attacks
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Solution Overview
Problem
Existing semiconductor chips face vulnerabilities to optical and invasive attacks, such as laser probing and focused ion beam (FIB) techniques, which compromise the security of sensitive circuitry by exposing and altering encryption keys and circuit designs.
Innovation Solution
A bonded structure is formed by directly bonding a protective semiconductor element with obstructive and protective circuitry layers to the active chip, where the obstructive layer prevents optical and FIB attacks, and the protective circuitry layer detects and disrupts unauthorized access by mimicking sensitive circuitry or disabling the chip upon detection of tampering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If no protective element is used, then the device complexity is low, but the security against optical and invasive attacks is insufficient
Solution Approach 1:
The protective element is bonded directly to the active chip, creating a nested structure where the protective layer encapsulates and protects the sensitive circuitry. This nesting approach provides security protection while maintaining a compact form factor without significantly increasing overall device complexity
Solution Approach 2:
The protective element acts as an intermediary layer between external threats (optical probes, FIB attacks) and the sensitive active circuitry. This mediator blocks harmful interactions while allowing necessary electrical connections to pass through via through-substrate vias
2Reliability
If an obstructive layer is added to prevent optical and FIB attacks, then the security is improved, but the device complexity increases
Solution Approach 1:
The protective element serves multiple functions simultaneously: it provides optical obstruction to prevent laser probing, acts as a physical barrier against FIB attacks, and maintains electrical connectivity through integrated through-substrate vias. This multi-functionality reduces the need for separate protective components
Solution Approach 2:
The protective element comprises a composite structure with an obstructive layer made of materials that block optical and ion beam penetration, combined with conductive pathways for electrical connections. This composite approach provides comprehensive protection while managing structural complexity
3Manufacturing precision
If the protective element is directly bonded without adhesive, then the manufacturing precision is improved, but the ease of manufacture decreases
Solution Approach 1:
The patent replaces traditional mechanical adhesive bonding with direct bonding technology, eliminating the need for adhesive materials and associated alignment tolerances. This substitution achieves superior bonding precision while simplifying the manufacturing process by removing adhesive application and curing steps
Data Source
AI summary
A bonded structure with protective semiconductor elements including a semiconductor element with active circuitry and a protective element including an obstructive layer and/or a protective circuitry layer. The obstructive layer is configured to inhibit external access to at least a portion of the active circuitry. The protective circuitry layer is configured to detect or disrupt external access to the protective element and/or the active circuitry of the semiconductor element. The semiconductor element and the protective element are directly bonded without an adhesive along a bonding interface.