Bonded Semiconductor Light Sensor for Compact Displays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light sensors for display devices are bulky and inflexible, making them unsuitable for compact and thin applications, and their manufacturing processes are costly and complex, especially when integrated with color filters.
Innovation Solution
A semiconductor device design where a photodiode and amplifier circuit are formed on one substrate, and a color filter and overcoat layer are formed on another, with both being bonded using a bonding material, allowing for a lightweight, thin, and flexible photoelectric conversion device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional light sensors are integrated with color filters on the same substrate, then functional completeness is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The light sensor is divided into two separate substrates: a first substrate containing the photodiode and amplifier circuit, and a second substrate containing the color filter. This segmentation allows each substrate to be optimized independently and simplifies the manufacturing process while maintaining functional completeness when the substrates are bonded together.
Solution Approach 2:
The patent combines the photodiode substrate and color filter substrate through bonding to create an integrated light sensing system. This merging approach achieves functional completeness by integrating all necessary components while avoiding the complexity of monolithic integration by using separate but bonded substrates.
2Adaptability or versatility
If conventional light sensors are integrated with color filters on the same substrate, then functional completeness is improved, but manufacturing cost increases
Solution Approach 1:
By segmenting the light sensor into separate substrates (photodiode substrate and color filter substrate), the manufacturing process becomes simpler and more cost-effective. Each substrate can be manufactured using optimized processes independently, avoiding the complexity and cost of monolithic integration.
Solution Approach 2:
The photodiode and color filter are prepared on separate substrates in advance before final assembly. This preliminary action allows for independent optimization and manufacturing of each component, reducing overall manufacturing cost and complexity while maintaining functional completeness upon bonding.
3Measurement precision
If conventional light sensors are used in display devices, then illuminance detection capability is improved, but device size increases
Solution Approach 1:
The light sensor is segmented into thin-film structures on separate substrates, enabling compact integration. The photodiode substrate and color filter substrate can be bonded in a compact arrangement that maintains illuminance detection capability while significantly reducing the overall device volume compared to conventional bulk sensors.
Solution Approach 2:
The patent uses thin-film semiconductor structures for the photodiode and amplifier circuit, which enables compact device design. The thin-film approach reduces device thickness and volume while maintaining the necessary illuminance detection functionality for display applications.
4Measurement precision
If conventional light sensors are used in display devices, then illuminance detection capability is improved, but device flexibility is reduced
Solution Approach 1:
By dividing the light sensor into separate substrates that can be independently designed and bonded, the patent achieves both illuminance detection capability and device flexibility. The segmented architecture allows the final device to be integrated into flexible display configurations while maintaining sensing functionality.
Solution Approach 2:
The thin-film semiconductor structures used in the photodiode and amplifier circuit enable the device to be made flexible. This thin-film approach, combined with the separate substrate architecture, allows the light sensor to adapt to flexible display form factors while maintaining illuminance detection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in a compact, thin, and flexible photoelectric conversion device that reduces manufacturing costs and enables miniaturization of light sensors, suitable for various display applications.
Implementation Method 1
a photodiode and an amplifier circuit which amplifies output current of the photodiode
Data Source
AI summary
A semiconductor device including a first element including a photodiode and an amplifier circuit which amplifies output current of the photodiode, over a first insulating film; and a second element including a color filter and an overcoat layer over the color filter over a second insulating film is manufactured. The first element and the second element are attached to each other by bonding the first insulating film and the second insulating film with a bonding material. Further, the amplifier circuit is a current mirror circuit including a thin film transistor. Still further, a color film may be used instead of a color filter.