Protective Bonded Structures With Circuit Disruption on Debonding
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Solution Overview
Problem
Semiconductor chips with security-sensitive components face challenges in protecting against unauthorized access through various hacking techniques, including delayering and electromagnetic interference, as existing materials may be incompatible with semiconductor processing or have high processing temperatures, limiting their effectiveness in standard foundries.
Innovation Solution
A protective element with a destructive or light-blocking obstructive material, such as diamond-based materials or ceramics, is directly bonded to the semiconductor element without an adhesive, positioned close to the bond interface to prevent physical and electromagnetic access, and includes a disruption structure that damages circuitry upon removal, enhancing security by blocking access and disrupting functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-hardness obstructive materials (diamond-based materials, ceramics) are used to prevent physical access, then security protection is improved, but manufacturing compatibility with standard foundry processes deteriorates
Solution Approach 1:
The protective structure is divided into multiple functional layers: an obstructive material layer (diamond-based or ceramic) for physical protection, and a disruption structure layer containing chemically reactive materials that damage circuitry upon removal attempts. This segmentation allows each layer to be optimized independently for its specific function while maintaining overall manufacturability.
Solution Approach 2:
The patent employs composite material structures combining obstructive materials (diamond, ceramics) with disruption materials (chemically reactive substances) in a layered configuration. This composite approach enables the structure to provide both physical obstruction and chemical disruption functions, resolving the contradiction between security effectiveness and manufacturing compatibility.
2Reliability
If obstructive materials are positioned close to the bond interface to block access, then security is improved, but the risk of damaging underlying circuitry during removal attempts increases
Solution Approach 1:
The disruption structure converts the harmful effect of removal attempts into a beneficial security feature. When attackers attempt to remove the obstructive material, the disruption structure's chemically reactive materials are exposed and automatically damage the underlying circuitry, transforming the removal action from a potentially successful attack into a self-destruct mechanism that protects the IP.
Solution Approach 2:
The disruption structure is pre-configured with chemically reactive materials that will counteract any removal attempt before it can succeed. The structure anticipates potential attacks and prepares defensive chemicals in advance that will neutralize the removal action by damaging the circuitry, preventing successful access to protected IP.
3Ease of operation
If adhesive bonding is used to attach protective elements, then ease of assembly is improved, but security against chemical debonding attacks deteriorates
Solution Approach 1:
The adhesive layer is completely removed from the bonding interface between the obstructive material and the substrate. This extraction of the vulnerable adhesive component eliminates the weak point that chemical attackers would exploit, forcing them to directly attack the much more resistant obstructive material and disruption structure.
Solution Approach 2:
A direct bond interface is created between the obstructive material and disruption structure without adhesive intermediaries. This eliminates the vulnerable adhesive layer that would otherwise provide a chemical attack pathway, while still achieving secure attachment through the inherent bonding properties of the directly bonded interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents unauthorized access and disruption of sensitive circuitry by using high-hardness materials that are difficult to remove or penetrate, while the disruption structure ensures that attempting to remove the protective element damages the underlying circuitry, significantly resisting reverse engineering and hacking attempts.
Implementation Method 1
the obstructive material is configured to block light and electromagnetic waves from accessing the sensitive circuitry
Implementation Method 2
directly bonded to the semiconductor element without an adhesive along a bonding interface
Data Source
AI summary
A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over at least a portion of the active circuitry. The obstructive material can be configured to obstruct external access to the active circuitry. The bonded structure can include a disruption structure configured to disrupt functionality of the at least a portion of the active circuitry upon debonding of the protective element from the semiconductor element.